Electronics Forum | Mon Feb 08 16:11:10 EST 2010 | glennster
Dave, I agree totally, but dye-and-pry should also be part of the evaluation. Glenn Robertson Process Sciences Inc
Electronics Forum | Mon Feb 08 17:11:34 EST 2010 | woodsmt
Thanks Dave and Glenn, I have setteled on Dye for the destuctive checks, and was thinking about impedence testing at intervals during ESS. Based on the research I have been doing the last several days, this seems like a method that should identify
Electronics Forum | Sat Oct 09 03:45:34 EDT 1999 | Brian
| Right now,we have some problem on SMT. Cause of the flux residue | in the connector. Do somebody have the same symptom? By the way, | can i find something to make the flux observe easy or take a photo with the flux. | | | Unfortunately, this pr
Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella
When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so
Electronics Forum | Thu Feb 08 15:05:32 EST 2007 | realchunks
Wow, what a bunch of crabby old men. BGA opens can occur from pre,during or post process. I never chimmed in cause the original poster said they would performa a dye test. Yet as usual, they never get back to this forum on what the cause was. So
Electronics Forum | Fri Aug 19 02:16:40 EDT 2011 | ppcbs
In my opinion destructive methods went out with the stone age. At least they did at our company. We specialize in non-destructive defect analysis. We can determine where the failure is i.e. assembly process, fab defect, BGA defect or plating proce
Electronics Forum | Fri Aug 19 05:07:00 EDT 2011 | robertwillis
Its not a problem to do you just modify the procedure slightly for the smaller thinner parts. There some images and on my CD ROM and posters see http://www.packageonpackage.co.uk website I will also be doing a workshop at APEX and there is a webinar
Electronics Forum | Wed Mar 04 13:06:45 EST 2015 | cyber_wolf
A full blown analysis could become very expensive. There are many test that can be performed. 3D acoustic microscopy, X-ray, Dye and pry,and I'm sure the list goes on. Typically, a micro-cross section report of the BGA solder joints will show you w
Electronics Forum | Fri Jan 10 03:40:41 EST 2020 | jakapratama
Hi, Some nano coat supplier said that you can drop water to the surface where the coating supposed to present before to check. If it's beading, it's still there. I take it that you meant by self in-house wiping of coating, yes? Stencil supplier nan
Electronics Forum | Fri Jan 10 14:41:02 EST 2020 | slthomas
I'm wondering if anyone has ever done a before/after test on the wipe-on type to see if it's any better. The factory applied stuff has been a game changer for us and as already stated, has the added benefit of a dye to indicate that it's still ther