Electronics Forum | Thu Aug 25 08:54:24 EDT 2005 | stepheniii
Could it be cold solder? Are there parts nearby that might be soaking up lots of heat, or maybe lots of internal grounding near that corner? Once I saw something similar except it was on two different assemblies. Each time it was on the side of the
Electronics Forum | Sat Jan 28 13:28:15 EST 2006 | eeltec
Dear All: I am learning to program a Philips Comet GEM Machine with VIOS. I am programming a simple PCB that has 300 components but just 3 part numbers so I want to build a complete board in each table of the machine (A and B) and until now I have no
Electronics Forum | Thu Jun 22 12:03:58 EDT 2006 | Chunks
Oh yeah, I forgot about the great big burn of 2006 you and davef laid on me. Wow, good one fellas. Now high five each other. Don't forget the butt slap. Now belly slam! (wow 578 lbs of flab just met in a cube somewhere!) Rub each others bald spo
Electronics Forum | Mon Dec 10 01:55:54 EST 2007 | Frank
Here are some questions you should be considering... How many of each machine type are actually installed and being used in the market? What is the local support in your area from each vendor? Where are their spare parts warehoused? What is the w
Electronics Forum | Tue Jan 07 11:15:03 EST 2003 | gijsalbada
Yes it is, but very close to each other.
Electronics Forum | Tue Sep 16 09:02:16 EDT 2003 | Graeme
Murtuza You have recieved loads of good info mainly all the preventive maintenance to be done. But can I ask was all of components placed twisted or just some when machine was run at full tact time 0.12s, I ask this as I run a 4791 and if its only so
Electronics Forum | Fri Apr 30 18:52:22 EDT 2004 | RicardoF
what about 4 cm of kapton tape on each Thermocouple?
Electronics Forum | Fri May 21 03:01:22 EDT 2004 | Nitro
I want to know the pressure of N2 in each zone in furnace. If have standard it will better.
Electronics Forum | Fri Jan 28 12:29:01 EST 2005 | Bob R.
We use the exact same method Chunks outlined for evaluating just about anything we're going to roll out worldwide, whether it's a material or a machine. List your factors (print speed, solder spread, etc), assign each a weight, evaluate each paste a
Electronics Forum | Fri Sep 23 03:10:03 EDT 2005 | dougs
Sounds like your using global fids, if there are marks on each board use local fids and that should help.
