Electronics Forum: electroforming (Page 5 of 8)

Re: paste release from stencil, and volume calculation

Electronics Forum | Mon Nov 15 12:13:41 EST 1999 | Dave F

Steve: There are guidelines for determining if your aperture has the correct proportions to the foil thickness. Maybe that�s what you�re looking for: 1 Aspect ratio = aperture width/foil thickness Chemically etched SB GT 1.5 Laser cut SB GT 1.2

Re: electroformed stencils

Electronics Forum | Thu Jun 03 17:36:38 EDT 1999 | Dave F

.020" pitch spacing. Which have yielded my process excelent results. | My main stencil supplier is I-Source in Irvine, CA and has pretty much standardized on 100% lazer cut stencils for competetive pricing. | Hope this helps. | | Deon Nungaray | SM

QFP Coplanarity & Alloy 42

Electronics Forum | Wed Oct 01 13:39:13 EDT 2003 | arturoflores

They take the solder in a dip and look solderability test but when in normal reflow process we got some pins that do not get wet and the appearance is as follows: -Pillow effect on the toe(no front fillet is formed) -There is a sheet of flux between

Stencil thickness

Electronics Forum | Thu Jun 16 18:19:05 EDT 2005 | Jason Fullerton

If the uBGA has aperatures that are 0.25mm square, you need to use a laser cut foil no thicker than 3.75 mils to get an area ratio of 0.67, which is the minimum rule of thumb - that's too thin! Electroform would probably work up to 4.5 mils thick.

Pb Free Voids

Electronics Forum | Wed Feb 14 12:09:34 EST 2007 | rob_thomas

This was a rather intersting little project to work on due to the fact that I had such a variety of components placed in SMT ( your regular 0402 passives, ,BGA's Qfp's ,TH and SMT connectors ,plus the pesky micro BGA) I ended up with a 5/3 mil electr

Stencil Design

Electronics Forum | Mon Jun 01 18:44:54 EDT 2009 | scunneen

Hello there, I have a new board, fairly heavily populated with a number of FPBGA on it. The smallest has a pitch of .4mm.I have 3 questions, 1st what is the best appeture for this small pitch. 2 Will type 3 paste work or will I need type 4, and fina

BGA flux dipping process

Electronics Forum | Tue Jun 16 14:46:25 EDT 2009 | grantp

Hi, If your using NXT to place these BGA's then you must be doing large runs. BGA's are the most easy part to place, and don't worry about them. Just stencil paste down for them as any other component. But we use 1:1 reduction on our stencil, so we

Paste printing fine pitch components

Electronics Forum | Mon Oct 14 10:53:28 EDT 2013 | emeto

0.5 if you use electroformed stencil or > 0.8 if you use laser cut. 2. Always use fresh paste 3. Uses the right printer parameters for your paste(for example Alpha likes fast release of the stencil from the board - in DEK this is called separation s

Electroforming Directory

Electronics Forum | Thu Mar 06 09:25:13 EST 2014 | davef

Stencil, Electroformed * AGI, 177 Nick Fitcheard Rd, Huntsville, AL 35806; 256-858-3300 F256-858-3304 agicorp.com * ALPHA® Form™ alpha.alent.com * Chepaume Industries, 6001 Airport Road, Oriskany, New York 13424; 315-768-7001 F315-768-0270 info@chepa

Re: screen printer and stencil printer

Electronics Forum | Wed Aug 18 15:20:25 EDT 1999 | John Thorup

| Hi, | I'd like to ask some tips about the merits and shortcomings o | of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our | application? | The boards contain no BGA and


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