Electronics Forum | Tue May 21 16:18:57 EDT 2019 | edhare
Interesting problem. I've seen this before on SMT device leads (see Gold Embrittlement paper at http://www.semlab.com). The AuSn4 IMC is solid at typical reflow temperatures and traps volatiles in the solder joint. One usually cannot crank the ref
Electronics Forum | Wed Jul 12 11:26:12 EDT 2006 | flipit
Hi, I believe you have classic gold imbrittlement here. With 80 microinches of gold you are way over the limit. You can try to reflow longer time and at a higher temperature. The gold does not melt into the solder joint. The gold dissolves into
Electronics Forum | Mon Sep 11 04:10:46 EDT 2000 | Jim Arnold
I spent 25 years operating my own hybrid shop working with surface mount components, soldering materials and procedures. Dealing all the while with it's associated surprises and problems such as yours. Now-a-days I get paid to investigate and attemp
Electronics Forum | Wed Jul 26 10:06:19 EDT 2000 | Doug Philbrick
I have read many of the past threads on both topics and I still am not convinced I know the answer to the soldering problem we are encountering. I am hopping someone can help. I have a dense SMT board we are building and have been building for some
Electronics Forum | Fri Jun 19 14:25:24 EDT 1998 | Earl Moon
| | Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | | Mike | There has b
Electronics Forum | Fri Nov 10 17:44:48 EST 2000 | Dave F
In response to your questions: Is the embrittlement from excess gold in lead / tin solder connections bad? It can be vereeee bad. Does it affect all plating processes the same? Give us a break and read the SMTnet Archives, for instance: BGA prob
Electronics Forum | Mon Dec 13 10:12:45 EST 1999 | John Thorup
Hi Dennis The gold plating on a circuit board is present to protect the nickle plating from corrosion. The layer is so thin that as it goes into solution in the solder it constitutes only a small percentage of the total joint. It is commonly accept
Electronics Forum | Wed Jan 09 14:52:53 EST 2002 | Chris
Hi, I have read many articles about theromsonically bonding to soft gold. Many of these articles state you can bond to 10uinches of gold. I have worked with both Hughes and Panasonic bonders at two different companies and I have never been able to
Electronics Forum | Thu Sep 12 11:26:11 EDT 2002 | scottefiske
CK, If joints have been validated prior to ICT (under BGA Scope), more often than not repeatable joint fractures are due to undo stress being placed on the component during ICT test. Verify ICT probes and fixture. If after proving out fixture/pin com
Electronics Forum | Tue Jun 01 16:44:02 EDT 2004 | davef
Se�or Tech: Would you believe it!!! We had the same thing about a week ago. The carbon layer is real thin, almost a brownish color, correct? Couldn�t figure it out for nuthin�. We were all just standing around like dupes, without a clue. We ende
