Electronics Forum: ersa pull off (Page 5 of 32)

Component Skew during Reflow Process

Electronics Forum | Thu Aug 01 11:43:57 EDT 2019 | slthomas

I noticed that your solder mask registration is off some. Does it cover a significant portion of any of the pads for these parts? If so, is it possible that the surface tension of the solder at liquidus is enough to skew the part when the solder i

Sticky solder, solder flagging, bridging.

Electronics Forum | Fri Apr 21 21:32:06 EDT 2023 | dwl

What kind of fume extraction are you using? If its too high, you could be pulling the nitrogen off of the nozzle.

Component placement

Electronics Forum | Thu Apr 11 11:06:27 EDT 2013 | ericrr

1) I think maybe not, however having said that, our conveyor does not work between the final placement machine and the oven, in the early days before I became a "experienced" operator in pulling the board out of machine running it along the track to

Grainy Solder Joints

Electronics Forum | Fri Jun 25 11:29:43 EDT 2004 | tcp

We have had some field returns of a double sided SMT board manufactured in the February timeframe. The boards are encapsulated in an epoxy potting. When removing the potting some SSOP devices came off in the potting. The leads had pulled out of th

temperature induced IMC in wire bonds?

Electronics Forum | Tue Nov 15 12:21:20 EST 2005 | arclightzero

Well, I can't speak for them falling off later on, as that's not when I see them, and they are passing their wire pull tests after bonding. What I am seeing is electrical opens during testing, and these opens coincide with the Au/Al bonded points. Th

ENIG (thru hole ring turns black after wave soldering)

Electronics Forum | Tue Aug 02 15:03:37 EDT 2016 | davef

On a previous black pad experience we soldered a wire to a fiducial and did a pull test to failure. On the black pad board the wire and solder pulled of clean leaving the fiducial on the board. On good boards the copper came off with the wire. If you

Component ( Connector ) drop during secondary reflow

Electronics Forum | Mon Dec 03 15:03:49 EST 2018 | dleeper

I can't open your spread sheet to see how you calculate this, but usually this sort of calculation assumes the leads are spaced symmetrically on both sides of the part and the center of mass is between them. Gravity pulls the part down, while the wet

Fiducials on feeders

Electronics Forum | Wed May 22 15:56:43 EDT 2002 | stefwitt

The play of the tape is quite significant as I mentioned in an earlier thread. Tape width can vary between 8.1 +/- 0.2mm. Demos on 0201's are most likely done with 8.1 +/- 0.05mm tape. I guess you are referring to the cover tape pull, which can dispo

Qualifying a new SMT automated assembly line

Electronics Forum | Tue Oct 14 09:26:15 EDT 2008 | bickt

Hi, I have been at both ends of this business. I installed lines and have been in manufacturing for some 25 years. Do not go by the test boards that the installer or OEM uses. these boards are too broad and loose for any kind of guide line to est

BGA process requirements

Electronics Forum | Fri Apr 19 08:01:40 EDT 2002 | jnunns

We have been doing BGAs for about 3 years in house. We started off with an outside contractor and then brought it in. We are doing a variety of sizes from .05 to .03 pitch. We have 2D capability at print, but do not use it on any but the .03 pitch. T


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