Electronics Forum | Wed Mar 23 11:40:21 EDT 2022 | SMTA-64388039
In my experience a distance of 30 mils per 1 mil in height above PCA nominal is sufficient for the squeegee blade to bend (in the direction of squeegee travel) so that you don't have excessive solder issues near the label. Labels are about 5 mils ta
Electronics Forum | Tue Aug 22 05:10:56 EDT 2000 | Wolfgang Busko
Ron:It�s tricky to get what you want with this foamfluxers espacially using pallets. They got to be cleaned regularly. Most of the time excessive residues are removed using brushes which adds another process step. It should be better using a sprayflu
Electronics Forum | Wed May 03 13:57:20 EDT 2000 | Stefan Witte
Mark, I guess while your machine sits idle, it could do boards. While the machine processes boards it breaks down by a certain percentage rate. I would multiply the placement rate with the idle time, multiplied by uptime divided by hundred. 10.000 (
Electronics Forum | Wed Jul 08 15:18:20 EDT 1998 | Upinder Singh
We are wave soldering a board having 24 similar thru hole connectors on it, using a wave soldering pallet. The problem is that one particular pin of connector in around 6-9 connectors get excess solder on the bottom side. I have tried all the parame
Electronics Forum | Thu Jul 09 17:12:00 EDT 1998 | Dave F
| We are wave soldering a board having 24 similar thru hole connectors on it, using a wave soldering pallet. The problem is that one particular pin of connector in around 6-9 connectors get excess solder on the bottom side. I have tried all the par
Electronics Forum | Thu Feb 19 12:56:29 EST 1998 | Earl Moon
| I'd like someone gives me a tip for elemating of voids | in the mico BGA solder joint and the method of inspection | of them, very exactly. Voids in excess of 20% by each solder ball volume is cause for rejection. Causes are improperly managed proc
Electronics Forum | Thu Mar 17 10:14:30 EST 2005 | davef
If you're washing the boards properly, you should see any problems, maybe a little extra floaming, but that won't be too bad. If you're running no clean, you need to aplly flux according to your supplier's recommendations. If you decide not to foll
Electronics Forum | Thu Jun 16 22:14:51 EDT 2005 | davef
16 thou pitch parts: Use a 5 thou laser cut electropolished stencil with 0.008"x0.045" apertures and type 3 solder paste. Bridges Connecting or Partially Connecting Adjacent Leads or Lands * Excessive solder paste * Excessive component placement pre
Electronics Forum | Thu Dec 15 11:06:05 EST 2005 | Samir Nagaheenanajar
You might wanna try a small reduction in your stencil aperture. For example, for a 30-mil pad go 26-mil square aperture with 8 to 10-mil radius on your corners. Also, look at your designs. Is there enough resist between your pad and ball? Another
Electronics Forum | Wed Dec 06 22:35:05 EST 2006 | davef
Questions are: * When you say, "corner of some board's BGA chips", is it on the top of the package or between the board and the bottom of the package? * If between the board and the bottom of the package, does it span the distance between the board a
