Electronics Forum: failed pull test (Page 5 of 60)

Conformal Coating Issues

Electronics Forum | Fri Jun 01 06:40:39 EDT 2012 | umar

Hi Norman... Thansk on yoru input, actually my adhesion test conduct is after pass of IC test. MY IC Test is shown a good result but when go into teh Test adhesion coating then during peel off test my board was failed.

Push&Pull Test of Fine Pitch Components

Electronics Forum | Fri Sep 19 14:11:39 EDT 2003 | Bryan Sheh

Dear all, Is there anyone who has the experience in conducting Push&Pull test for fine pitch components?i.e.SOIC,QFP. The customer clearly stated that,"every lead should be tested for selected components".but, you know that,the fine pitch,0.5 or

Plating for aluminum wire bonding

Electronics Forum | Tue May 13 21:08:24 EDT 2003 | ramanandkini

Dear Sir, Sorry for the delay in reply. This is regarding MIL standard for bond pull strength: MIL-STD-883C dt.25/08/83 Bond strength (destructive bond pull test); refer table-1 Minimum bond strengths for various wire composition & diameter given.

how to measure Adhesive strength

Electronics Forum | Fri May 15 09:41:58 EDT 2009 | cyber_wolf

Use loctite chipbonder and forget about all this pull testing. I know that Loctite works good because it pulls a chunk of solder mask off the board when you push a part off.

Hanwha Samsung SM320 Failed to Start Mark5 SW - VME broken ?

Electronics Forum | Tue Dec 13 20:25:02 EST 2022 | proceng1

Ok. My older machines have a hard drive in a socket that pulls out with a key.

Re: Pull Test

Electronics Forum | Tue Apr 07 05:48:12 EDT 1998 | bob willis

800 g for a part of that size.

COB setting for Electrolytic & Electroless Gold

Electronics Forum | Fri Oct 22 10:41:08 EDT 2010 | janz

hi 1) just run test batch and pull test wire. Use MIL std to find out your results. 2) again run through and test wire.

Solder Joint Strength on Fine Pitch

Electronics Forum | Thu Aug 16 13:57:30 EDT 2001 | Hussman

Ouch! I thought that went away 12 years ago! Visual inspection to IPC standards should be used. Pulling and pushing leads is not even close to being consistent. I bet your customers or ISO auditors have never seen this practice. If they must pul

Re: Wave Solder Problems - VIA HOLES

Electronics Forum | Fri Jun 04 10:02:06 EDT 1999 | Chrys Shea

| | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VIA hole

Re: Wave Solder Problems - VIA HOLES

Electronics Forum | Fri Jun 04 17:10:59 EDT 1999 | C.K.

| | | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VI


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