Electronics Forum | Wed Feb 20 18:05:24 EST 2008 | slthomas
Tented vias have solved problems for me in the past, but never created any. I have heard seemingly pointless discussions about whether or not the EE that designed the board designed it with filled vias in mind (a consideration of current carrying c
Electronics Forum | Fri Dec 17 14:30:42 EST 2004 | Dreamsniper
I goy this issue: Voids in almost every ball of my BGA's prcessed since we changed our BGA via tenting to double tenting. The tenting is done with a dry film application to fill the via from the solder side then apply LPI Mask on the surface of the
Electronics Forum | Fri Dec 17 14:31:52 EST 2004 | Dreamsniper
I got this issue: Voids in almost every ball of my BGA's processed since we changed our BGA via tenting to double tenting. The tenting is done with a dry film application to fill the via from the solder side then apply LPI Mask on the surface of the
Electronics Forum | Tue Dec 17 16:27:02 EST 2002 | davef
I�m not clear on the problem. What I get: * Your fabricator did not deliver the product that you asked for in your purchase order. * Pad. Land. A portion of a conductive pattern used as a termination area. Metal surrounding a hole on a printed ci
Electronics Forum | Tue Jan 20 11:54:12 EST 2009 | smt_guy
Is this Corrosion? We found our boards with this issue 45 days after they were delivered to us from supplier. The board finish is HAL Leaded. But I noticed that the corrosion like issues are coming form the tiny via holes with SILVER EPOXY FILLING.
Electronics Forum | Fri Jun 11 08:38:55 EDT 2004 | davef
We figured you were going to say that. Pay me now, or pay me later, you call it. As an alternative: * Cover the backside of the via with masking tape that will take soldering temperature, like Kapon, or a temporary solder mask * Enlarge the apertur
Electronics Forum | Tue Jul 22 20:38:28 EDT 2003 | Paul T.
Have the PCB fabricator use a conductive paste to fill the vias and then finish by plateing over the via. Make sure it's coplanar to the side they're on, usually secondary side for discretes. PT
Electronics Forum | Mon Aug 07 13:27:40 EDT 2017 | dleeper
Are you seeing this on bare PCBs or after assembly? with Immersion silver, the finish over the copper should be very thin and uniform, that's the main advantage of ImAg. You should not be seeing excess plating filling vias unless: A)Its HASL, not
Electronics Forum | Sun Dec 15 22:31:43 EST 2002 | craigj
Has anyone heard of vias cracking (barrel from pad) when being wave soldered. Was told this was a big problem by contract pcb designer, he always tent vias because of this. The reason was that the solder filling the vias caused stressing and then sep
Electronics Forum | Mon Sep 12 07:03:26 EDT 2011 | mosborne1
Can you post a picture? There are many reasons why they probably don't fill. There needs to be a larger surface area on the ring on top. There could be debris in the via holes from not properly drilled or cleaned before plating process. Your customer