Electronics Forum: flex cicruit reflow (Page 5 of 12)

Flex circuits

Electronics Forum | Sat Jul 03 10:03:22 EDT 2004 | Bryan Sherh

Things to consider are: * Thermal expansion > characteristics of you flex and your pallet > should be better matched. We use G-10. * > Placement of your two sided tape should be > better, more uniformly distributed. We run strips > the length o

cap size and copper thickness vs part size questions

Electronics Forum | Mon Nov 07 12:25:32 EST 2005 | Rob

Hi CW, Larger chip caps can be susceptable to cracking, but mainly this is due to handling - flexing of boards is the main culprit (the part being mechanically joined at both ends to the board). PCB's usually flex easiest along one axis, and larger

Solder print for TAB Bonder

Electronics Forum | Thu Apr 13 13:02:03 EDT 2000 | Paul Peterson

Hi fellow problem solvers,... We suspect a planarity problem with our 6 mil wide flex circuit pads having height variance of up to 2 mils after print and reflow. This is contributing to a placement skew with our TAB bonder... Has anyone had any succe

POST REFLOW BALLING

Electronics Forum | Wed Mar 13 10:20:51 EST 2002 | IAN T

WE HAVE A PROBLEM WITH SOLDER BALLING POST REFLOW WE ARE RELIABLY DISPENCING HERAEUS PASTE WITH A XY FLEX BUT WE'RE GETTING LARGE BALLS ON THE MELFS AND SMALL BALLS ON MOST CHIP PARTS WHAT SHOULD I BE LOOKING FOR? AND IS PAD DESIGN AN ISSUE (ROUND DO

Solder Paste Flux %

Electronics Forum | Sat Jun 11 07:24:26 EDT 2005 | buchi79

Russ, Thanks.By the way, i already look into the reflow profile & paste storage & thowing requirement. Even i cut down the stencil life to 4 hr to avoid any moisture absorbtion. If i were to change the paste formulation, what would you propose ? But

Flex Circuits reflowing

Electronics Forum | Fri May 02 16:58:39 EDT 2003 | swagner

We have been building with flex circuits for nearly three years now, its an automotive product utilizing lead free paste, I will give you a few pointers. 1. Evaluate your supplier carefully, make sure you have some kind of stretch tolerance on the p

PCB lamination issues

Electronics Forum | Sun Feb 11 23:32:43 EST 2007 | M.Haris

1. After reflow some boards start producing bumps/bubbles which damage the internal layers causeing PCBs failed in Electrical-testing. How can I eradicate this problem from my assembling process? 2. If SMT components are mounted on non-rigid FLEX PC

Lead Free and Leaded Process Mix

Electronics Forum | Mon Jul 18 13:34:31 EDT 2005 | jzaccari

Francisco, You need to be concerned about "lead-free" BGAs. The SAC balls will not reflow at at standard tin-lead process temps. I have seen many examples where this has been a very big problem. In once case the BGAs just poped-off when the board was

BGA failure at Functional Test

Electronics Forum | Thu Jan 08 10:56:13 EST 2009 | aj

Hi, Is there any PTH Assembly after reflow, we found cracked joints on some BGAs which was caused by operators ing Oupin connectors which were a tight fit. This caused the PCB to flex hence cracking joints. One way of checking for this during test

Large Footprint Flex PCBs

Electronics Forum | Mon Oct 05 11:51:55 EDT 2009 | mikesewell

We managed to run a ~30" board on an Assembleon Topaz/Emerald with only an 18" capacity by getting creative with the board sensors/clamping and running it as two programs, the manufacturer actually helped us through the workaround. I think we hand


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