Electronics Forum | Thu Jun 17 11:18:03 EDT 1999 | Ian Clelland
| | | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down fr
Electronics Forum | Thu Jul 03 07:43:50 EDT 2003 | davef
So, there is a crack or gap between: * Solder and component termination. * Component termination and component body. Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the terminatio
Electronics Forum | Thu Jul 03 12:03:00 EDT 2003 | slthomas
So, there is a crack or gap between: * Solder and component termination. Bingo Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the termination. Unfortunately at 45X I can't rea
Electronics Forum | Tue Sep 06 10:20:33 EDT 2005 | slthomas
I love these stories. At my previous employer we experienced intermittent failures on an audio microprocessor assembly being used on a *new* product. This board had numerous microprocessors and complex firmware aboard. They discovered one PLCC on
Electronics Forum | Mon Nov 19 21:42:51 EST 2007 | jwsmt
I'll e-mail pics to you. Answers to asumptions: * Flex in end-item use was measured at 410 microstrain * Supplier PPM last 12 mos less than 1 * Part goes through 2 reflow cycles; once on top and once on bottom * ICT microstrain was 1365; reduced to
Electronics Forum | Tue Jun 20 14:19:04 EDT 2000 | Chrys Shea
Hi Mike, The Hadco design guidelines are really good - I was just there. To expand on what Dave said, scoring is an option, but I've never had good luck with it, myself. The scores are either too shallow, and I can't break the boards easily enough
Electronics Forum | Fri Jul 10 14:16:06 EDT 1998 | Bob Willis
As Steve said there should not be a problem with cracking plastic components but if you are reaching 180c there will be a problem with secondary reflow on the top side of the board. PCBs flex during wave soldering as they do during reflow if not supp
Electronics Forum | Thu Nov 29 16:00:03 EST 2007 | jmelson
Desoldering often applies a LOT more heat and thermal stress to the part, and maybe mechanical forces while everything is hot, to get the part free of the board. So, a lot of damage might be done there, making post-mortem harder. Without the leads,
Electronics Forum | Sat Nov 22 09:27:18 EST 2008 | davef
IPC-HDBK-001 w/Amendment 1 Handbook and Guide to Supplement J-STD-001 (Includes J-STD-001B to C Comparison). During fabrication and storage, both components and PWBs will often absorb water. If left in the device, this water will vaporize at solderi
Electronics Forum | Tue Jun 16 15:01:58 EDT 1998 | Gary Simbulan
There are some common reason for capacitor cracking on my web page if you want to have a look. The document can be downloaded for your reference. | Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior