Electronics Forum | Sun Apr 22 23:46:28 EDT 2001 | z1040223
Hello all My company is getting ready to implement solder bump flip chips in the production line in the future. We are a contract manufacturer. We currently have the SMT facilities to do up to 1.5mm pitch BGA's, 0402 and other standard SMT. What equ
Electronics Forum | Thu Oct 15 21:29:42 EDT 1998 | Scott McKee
| I need to install some new lines for high mix low volume products in an already cramp building. Could someone share any info about the machines which give you the best bang for floor space. I need a 2 machine system for placing 0402 to fine pitch,
Electronics Forum | Fri Oct 16 00:18:35 EDT 1998 | Jim McCarten
I would not expect 30 microns to be good enough for flip chip. Maybe I have it wrong, but isn't that +/- 1.5 mils? With bumps on flip chip approaching 3 or 4 mils, I would stay away from a 30 micron machine! | |John, | | Why do not you consider t
Electronics Forum | Sat Sep 26 19:16:54 EDT 1998 | Graham Naisbitt
Ajit, How clean is clean? Are you running fine-line, fine-pitch; COB, BGA, Flip-Chip; making high rel circuits and putting them into a hostile environment? Well, as I have just posted to an earlier similar question on the SMTNet, there is no such thi
Electronics Forum | Wed Jun 11 09:58:35 EDT 2003 | swagner
Solder fillet inspection is something that I would avoid like SARS, solder joints are like a snowflake no two are the same, henceforth unrepeatability. The only time I would look into this would be for uBGA or flipchip on an audit basis utilizing X-
Electronics Forum | Thu Sep 02 02:30:08 EDT 2004 | Mike Konrad
Silverado, To answer your specific question, there are several manufacturers of batch-format cleaning systems. Aqueous Technologies www.aqueoustech.com Austin American www.aat-corp.com EMC www.emcgti.com UnitDesign www.unitdesign.com Each man
Electronics Forum | Thu Apr 28 08:29:22 EDT 2005 | andymackie
If what you are talking about is "assembly materials", then consider the following: - Solder paste - Wavesoldering fluxes - Bar (for filling wavesolder pots) - Underfill (for TCE-mismatched CSP's and flip-chip) - Cleaning fluids (for post-reflow boa
Electronics Forum | Wed Sep 19 15:54:31 EDT 2007 | samir
Hussman, I'm curious about the same thing. No offense to some of the people here, but this forum's getting frustrating in terms of the lack of expertise. Too many rookies from foreign countries new to SMT, some of them asking really dumb question
Electronics Forum | Fri Jan 30 14:20:55 EST 2009 | scottp
I do a lot of thermal cycle testing of new components for my company and often when I lay out a test board I'm trying to simulate 4 or 6 layer boards but I don't need them for routing so I just use a solid fill of a cross-hatch pattern. I've done it
Electronics Forum | Tue May 26 14:39:40 EDT 2009 | boloxis
QFN or MLFs are mainstream now, QFNs already evloved to much more complex versions now like matrix pins, stacked dice and flipchip versions. IPC 610D already includes them, just make sure the pins have solder plating, the PWB pads have soldermask in
