Electronics Forum | Thu Nov 06 10:21:38 EST 2008 | mendcorp
Does anyone have a glass dome intallation process of Silicone dome cast that can survive the standard IPC reflow profile for lead-free processes? Please shear it with us.
Electronics Forum | Mon Nov 27 20:44:01 EST 2017 | cmchoue
Dear expert's, I want to find the carrier that can support SMT print,placement,reflow and size can adjust. (My production is Motherboard) Does anyone have experience on it?or any infromation or photo can reference? Thanks Best w
Electronics Forum | Tue Nov 28 10:30:14 EST 2017 | georgetruitt
CHECK OUT INSULFAB OR STONE MOUNTAIN TOOL http://insulfabtools.com/gallery http://stonemountaintool.com/fixtures/
Electronics Forum | Thu Dec 07 11:21:56 EST 2017 | slthomas
It's been a while since I've dealt with them personally but I have worked with several guys that swear by Pentagon EMS for all of their fixturing. http://www.pentagon-ems.com/
Electronics Forum | Thu Feb 21 10:11:36 EST 2013 | patrickbruneel
The backflow in the wave started to become very important with the development of no-clean/no residue fluxes. These fluxes don’t have (or at least shouldn’t have) rosin, resin or other vehicles in the formulation which encapsulate surface oxides from
Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef
Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the
Electronics Forum | Fri Feb 22 09:41:54 EST 2013 | patrickbruneel
Pete, It would even be better if the wave machine manufacturers would add a feature that allows the wave to drop in rpm when a board passed the wave, and slowly get the wave back to normal rpm when a new board approaches. This would be like a reset
Electronics Forum | Wed Aug 03 12:54:20 EDT 2005 | russ
The process flow should be the same for all of these. I will admiot that I did not check each acronym you provided to see if any of these components require some sort of prep first before attachment.
Electronics Forum | Wed Aug 03 05:16:11 EDT 2005 | kokjianling
hi all, i want to find out the differences of the manufacturing processes between - PBGA - EBGA - CTBGA - Themally Enhanced PBGA(TEPBGA) - High Performance BGA - MCM-PBGA - Chip array - chip array (CASON) - Super FlipChip - flip Chip CSP (FCCSP) - St
Electronics Forum | Fri Feb 15 11:58:55 EST 2008 | rkeck
We are looking at an Omni Flow 5 Oven and do not have much information on it. We do know it has a 3" cabinet vent and a 6" vent near the center on the top. If anyone has knowledge of this oven, and has any suggestions or info, we would appreciate
