Electronics Forum | Tue Aug 20 21:46:09 EDT 2002 | davef
Rinse => OSP Coat => Rinse => Dry Hot Air Solder Level: Preclean => Rinse => Flux Coat => Solder Coat => Hot Air Level => Cool => Soft Brush => Post Clean Rinse => Dry Look here http://www.epa.gov/opptintr/dfe/pubs/pwb/ctsasurf/download/pdf/ch2.pdf
Electronics Forum | Wed Jan 03 12:33:37 EST 2001 | Terry Burnette
John, There is one process issue that occurs with the larger BGA packages which have coplanarity near the high end of the .2mm spec.. The defect is commonly referred to as "ball in cup" and "head in pillow". It is an open solder connection whereby th
Electronics Forum | Tue Jun 13 12:03:10 EDT 2000 | Chris May
Jason, If 225C is the topside temp of your board just prior to hitting the wave, I would say this is too high. Your flux suppliers data sheet should tell you an ideal topside temp for good flux activation, probably around 190C. According to the Bi
Electronics Forum | Wed Feb 02 21:17:55 EST 2000 | Steve Harshbarger
Istvan, The advise from both Roni and Mike sounds right on the money. The problem is most likely that your PCB is not completely dry (the flux has not completely evaporated) in the area where these solder balls occur. You have a number of differen
Electronics Forum | Sat Mar 24 00:50:24 EST 2001 | PeteC
Fresh paste from a factory sealed container. Should paste be scrapped out altogether if left on the stencil for too long (length-of-time?)? Our paste is Multicore CR39. Multicore reccomended the print chamber be around 22C @ 50%-60% RH. Our plant is
Electronics Forum | Wed Apr 07 09:54:32 EDT 2004 | Dreamsniper
Hi Guys, Can anyone help me in providing their experience in process related problems with regards to the above equipment? I noticed that it's slightly different with the wave soldering. Wave Process: Apply Flux, Pre-heat then Solder Selective Sol
Electronics Forum | Wed Feb 01 08:27:29 EST 2006 | Chunks
I haven't seen a hydrometer used in years. Are you still foam fluxing? There used to be automatic units available, but with the advent of the spray fluxer, they may have dried up. If you are still foam fluxing with alcohol thinner, place ping pong
Electronics Forum | Fri Dec 10 06:06:54 EST 1999 | Wolfgang Busko
Hi Glen, looks like flux or solder mask problem. In your first mail you said that only some boards show these symptoms and others not. First I would check on the differences between those Boards, manufactorer, solder resist, contamination. If that d
Electronics Forum | Thu Feb 28 14:04:39 EST 2008 | tonyamenson
What happens as solder paste is used when it becomes un-usable? Does it dry out due to flux evaporation or does it absorb to much moisture from the air which changes its composition too much? Now for the big question. I had an operator add flux to t
Electronics Forum | Tue Aug 04 14:29:14 EDT 2020 | dwl
Is the component an LGA or BGA? If its a BGA, it appears like the component is missing balls, if its an LGA, it appears like the solder isn't wetting to the component. What solder are you using? The wetting to the larger pads in the last pic seems
