Electronics Forum | Mon Jul 26 15:25:27 EDT 1999 | APE South, Jack Reed, Asian Sales Administrator
Dear Mr. Park, Ahn yahn haseo and good day to you. If you are currently in Korea, APE has a direct representative there, Omni-Create in Seoul who can give you full information on BGA reball kits available. Essentially, reball kits are custom made t
Electronics Forum | Wed Jul 22 08:10:24 EDT 2009 | olsa
Hello, this is my first question. More than 10 years my job was mobile phones repair, and for BGA repairing proces I used special template stencil, soldering paste and flux. Right now my job is notebook repair, and I'm interested about reballing of
Electronics Forum | Sun Dec 11 22:39:36 EST 2016 | ppcbs
We have been using the Amtech line for over 12 years now with all of our PCB and BGA Rework. The NWS-4400 is mildly active and will give better results with Lead Free Solder. Note that the LF-4300 is considered a No-Clean. However it will show lea
Electronics Forum | Tue Mar 05 03:58:10 EST 2019 | pcformax
Hello guys, In our company we use CS-FLUX for reballing purposes in the last two years and we have no complain about the product.if you want to see details about the product there is a very helpful tutorial in youtube named 'ATI GPU removal with the
Electronics Forum | Thu Dec 23 11:46:38 EST 1999 | g cronin
I am looking for a vendor for solder spheres and tack flux for BGA reballing. Preferibly on the east coast or new england area. My current distributors have them but require a min purchase of 200,000 that's a lot of balls!!!! thanks greg
Electronics Forum | Thu Jul 07 16:46:52 EDT 2005 | adrian
I am using pretty often the re-balling Winslow Automation kit for many BGA packages we have to re-ball. When I have started doing this, I've tried to use "BGA REBALLING INSTRUCTION" manual (PR-4048 REV.F), but it didn't work. For some reason, althoug
Electronics Forum | Thu May 13 19:43:57 EDT 2004 | My Nguyen
Hello all: We looking for an effective solutions for HIGH-VOLUMN BGA RE-BALLING. (i.e. cases where we got to scrap thousands of BGA modules and re-use the chip) BGA spec. (general) W: 8mm, L: 13mm, H: 1.12 mm, No. of ball: 60, Size: 0.45mm Pitch:
Electronics Forum | Mon Nov 17 13:26:05 EST 2008 | evtimov
With the gun you can do removal. Than clean the pads, put some flux, place new BGA(or reballed one) and put it in the reflow oven(if you have one). That's the cheap way you can go without buying an equipment. The other way is to buy machine for BGA
Electronics Forum | Thu Jul 17 04:42:47 EDT 2003 | sanjeevc
Hi! One technique: 1. Remove all balls 2.Make > a mask(stensil)for reballing.The holes of the > mask must be 0.8-0.9 the size of the pads. 3. > Reball chips 4. Reflow chips Good luck Hi Yes,we have done quite a bit of reballing of BGAs with
Electronics Forum | Sat Jun 05 13:38:22 EDT 2021 | ppcbs
For Linear Tech LGA's we solder bump the LGA using a .30mm solder ball then reflow with a tacky flux. This will provide a void free solder joint and adds a little height to the solder joint in case you use a flux that you want to clean from under th