Electronics Forum: footprint design (Page 5 of 13)

Pick&Place Defects may be from supplier & potential solution

Electronics Forum | Tue Apr 13 12:56:16 EDT 2021 | robl

Hi Tonies, Do you place 0201's from any other supplier? if so, do you see similar issues on those parts? There are a lot of things that can go wrong on 0201 & 01005 that aren't the part manufacturer - part data, printing, placement, nozzle sele

Jedec / IPC

Electronics Forum | Mon Sep 18 11:30:43 EDT 2006 | aj

Hi All, What is the difference between the above? Came across some conflicting design rules between the two - in particular 0402 smt footprint. aj...

SOLDER COST MODEL - PAD SIZE

Electronics Forum | Mon Dec 09 16:10:50 EST 2013 | davef

IPC-7351 Land Pattern Calculator and Tools [landpatterns.ipc.org/] Generic requirements for surface sount Design and Land Pattern Standards, is supplemented by a footprint expert software tool

QFP144 soldering problem

Electronics Forum | Sat Sep 15 13:00:44 EDT 2007 | slthomas

220 should be plenty although if they're lead free you might need a little more heat. Is it possible that you've got a paste volume issue (stencil design, clogged apertures), or maybe the footprint isn't right for the part? I had this same problem

Solder Robbing Pads

Electronics Forum | Wed Jun 26 09:10:21 EDT 2002 | davef

I want to suggest: * IPC-2221, Generic Standard On Printed Board Design * IPC-222X, Sectional Design Standard For Printed Board For Y Printed Boards ... but I just thumbed through both quickly and saw nothing, I really didn't spend as much time as I

Reflow soldering lead onto much larger pad

Electronics Forum | Mon Dec 07 14:55:41 EST 2015 | clydestrum

So I have an issue coming up that I'm not too sure how to handle. A board was designed with the wrong footprint for a 3-lead transistor in which the single-lead side has a much larger (think thermal pad for qfn) copper land than what is meant for the

Alum Electrolytic Caps

Electronics Forum | Mon Oct 17 05:35:00 EDT 2005 | Rob

Hi Harrit, We are processing SMT eleco's normally - up to around 8mm in height, the larger sizes can still be avoided and are through hole as the cost of them outweigh the benefit of surface mounting them (although we did get good results on test fo

Re: Standard pad sizes for reflow and wave

Electronics Forum | Sun Sep 05 03:52:11 EDT 1999 | Brian

| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes

Combining two similar footprints - absolute no, or might work - tips to improve odds?

Electronics Forum | Mon Apr 14 17:38:18 EDT 2014 | bradlevy

I've got a small smt board I've already got working prototypes of, which uses a tactile switch. I've got another much less expensive tact switch of similar size that I had avoided due to a difference in actuators I originally had no way around. Now I

BGA/Fine pitch footprints

Electronics Forum | Tue Mar 02 10:19:41 EST 2004 | loz

Hi all, we have recently seen a design that consists off a QFP100, pitch at 25". Also in the centre of this footprint is a FBGA165 footprint, pad size .4mm @ 1mm pitch. We have been informed that we will fit the QFP. I want to remove the BGA pads fr


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