Electronics Forum | Fri Sep 26 08:15:01 EDT 2003 | Gabriele
Forced gas (hot air or N2 according to solder paste or flux) will be the solution. To rework Ceramic (Aluminum lid Heat Sink)BGA (32 mm square ) or Ceramic Colum Grid Array C-CGA 1,25 and 1,00 mm colum (pitch 42,5mm square), also them capped with a
Electronics Forum | Wed Jan 05 11:26:15 EST 2005 | cyber_wolf
Then Z MOTOR > Then select>CALIBRATE FORCE SENSOR NOTE: you must have a tool in the head when you do this.(Without the tip/spring pushed in) After this calibration the force should drop to 0 when you push in on the spring loaded tip. 2.) Replace th
Electronics Forum | Wed Nov 02 13:24:09 EST 2005 | valuems
Hello Sorry we have not answered sooner, been gone. There is a height adjustment on the wiper. You will find a round nob under it, that is a height adjustment. I expect the wiper is not going all of the way up. And you can also control the speed
Electronics Forum | Mon Jan 23 03:17:10 EST 2006 | pavel_murtishev
Good morning, IR reflow is yesterday technology. IR heating principle has a lot of issues with heat transfer capability (shadow effect) and uneven PCB heating. To avoid this forced convection ovens were developed. Reflow oven for SMD soldering must
Electronics Forum | Thu Aug 31 16:18:30 EDT 2006 | GS
I beg you pardon AR, I made a mistake by reading your request, you are looking for a service lab who can do the peel back force test and not the Reference Standard (like EIA-481) for T&R. You should check if in your Country some Tape and Reeling Serv
Electronics Forum | Tue Oct 31 05:27:30 EST 2006 | Loco
Hi Ronald, We have both, 2x calrod on our leaded delta and calrod/convection on our leadfree, both are IR in 3th zone. Indeed, the forced convection is way more efficient, we can run it at 100deg C, where we would need 300deg C for the calrod for t
Electronics Forum | Tue Oct 14 09:17:09 EDT 2014 | rgduval
You could check the data sheets/web sites from the manufacturers of the press-fit parts. They typically will identify the recommended tooling/equipment necessary to install their components. Generally, pneumatic presses are suggested, with controll
Electronics Forum | Fri Mar 30 13:06:50 EST 2001 | aortiz
Hi, I need support on the method or applicable standard to measure the shear force strength on chip capacitors and resistors. I know the soldered joints strength is related to land desing, solder volume, pcb and component solderability, component
Electronics Forum | Wed Apr 14 13:52:21 EDT 1999 | Iliana Lopez
I'm trying to find out the standards of EIA-481 for Peel Back Force.
Electronics Forum | Wed Apr 14 13:53:43 EDT 1999 | Iliana Lopez
| I'm trying to find out the standards of EIA-481 for Peel Back Force. |