Electronics Forum | Mon Oct 23 21:05:37 EDT 2000 | cklau
If you're looking for PWB cleanliness , please consider one surface treatment other than HAL (i.e HRF-heat resist flux). HRF is a very inexpensive and effective process that your board manufacturer can provide you to meet your requirement. For gold
Electronics Forum | Wed Jan 26 14:33:47 EST 2000 | Glenn Robertson
Tuan - How about Sn/0.7Cu? It's M.P. is 227 and it's readily available. If the leads are Gold plated you might consider pre-tinning them. If you need a higher temp alloy any of the major solder companies can help - I suggets you start with Ind
Electronics Forum | Fri May 28 15:50:48 EDT 1999 | Frank Boyko
We now put soldermask on copper and then immersion nickel/gold plate our fine line boards. One of our vendors says this causes skipped plating in small via holes and wants to nickel/gold plate the whole board, including via holes, and then apply sold
Electronics Forum | Thu Aug 06 03:57:59 EDT 1998 | STONEY TSAI
Hi, friends, The gold plating and HASL boards made some difference on solderability for both reflow and wave soldering processes. It is difficult to investigate the interactions between raw materials and process parameters setting. Anyone provides th
Electronics Forum | Mon Mar 30 03:10:44 EST 1998 | Patrick Ng
Hi, We have encountered de-wetting issues with gold plated components( SMT LEDs ). The problem comes and go and we yet to locate the root cause ( process, component or solder paste etc ). The rest of the components on the boards are not having this
Electronics Forum | Mon May 06 00:09:00 EDT 2002 | ianchan
as a followup thought, what is your current peak reflow deg-C? and reflow timing (sec)? Au/Ni calls for reflow temperature of 217 deg-C for solder fusion that produces secondary eutectic alloy. there was one time we thought 183 deg-C was the magic
Electronics Forum | Wed Aug 06 16:35:31 EDT 2003 | Carol
This is an old topic, but keeps coming up. Solderability and reliability issues with SMT gold plated terminations when used with tin/lead solder paste/hassle finish PWB. I need to know which standard (mil, IPC, J-STD??) tells you all about the probl
Electronics Forum | Thu Sep 02 18:39:48 EDT 2004 | steveg
We're having a lot of problems with failed solder joints to gold-plated MOSFET leads. Gold plate thickness spec is 60uin, but we've seen as much as 200uin in cross-section, so we're obviously concerned about gold embrittlement issues. Pre-tinning w
Electronics Forum | Tue Jun 28 09:39:00 EDT 2005 | davef
Points to consider are: * Gold plating too thick [SB LT 8 uinches]. [Obviously, we're talking about actual plating thickness, not the specification.] * Reflow recipe improper [SB 220*C 5-10 sec]. A recipe that works fine for HASL needs to be hotter
Electronics Forum | Fri May 13 14:08:39 EDT 2011 | eezday
This appears to be black-pad and is often the result of using specs that call for gold plating that is too thick. The black pad is corrosion that is created between the gold and electroless nickel during the gold plating process. This is counter in