Electronics Forum | Sun Apr 05 00:23:53 EDT 2020 | researchmfg
1. To protect the nickel and copper under gold plating from oxidization before soldering. Gold plating can extend the PCB self-life and improve the solderability for 2nd re-flow. 2. Provide a good bonding strength. For Chip on Board process that Gol
Electronics Forum | Fri Feb 28 10:07:29 EST 2020 | stephendo
Flatness is only half of the advantage. Gold doesn't corrode. There are other flat surfaces but do not last as long as gold.
Electronics Forum | Fri Feb 28 11:02:06 EST 2020 | slthomas
I'm not 100% sure which type of gold you're asking about, but if you're talking about hard gold plating, I think the most common use is to provide a durable surface for things like membrane switch contacts because it resists abrasion and other mechan
Electronics Forum | Tue Jul 11 12:59:26 EDT 2006 | mattkehoe@sipad.com
We are trying to apply solder to boards with 80 microinches of electro plated hard gold. No components involved, just print 63/37 paste and reflow. The results are very poor on some boards, not so bad on others? Pictures at http://www.sipad.net/thick
Electronics Forum | Fri Feb 28 01:36:43 EST 2020 | crystal12
> What is the use of gold plated boards? <BR> <BR> With the increasing integration of IC, the more IC the more dense. The vertical tin spray process is difficult to flatten the pads, which brings difficulty to the SMT mounting, and
Electronics Forum | Tue Jun 28 19:58:59 EDT 2005 | davef
Michael: What's this "tint"? How do you do it? Tell us more, please.
Electronics Forum | Tue Jul 11 14:09:54 EDT 2006 | Chunks
Not reflowing completely. Slower = hotter. Try a slower conveyor speed.
Electronics Forum | Wed Jun 29 17:18:41 EDT 2005 | GS*
Very interesting tread, many thanks to all. Matt please, now what does it mean for you? Will your custmer accept dull solder joints or will the plating be changed ? (ie. HASL, ENIG, etc) Tnks and regards GS*
Electronics Forum | Tue Jun 28 07:27:32 EDT 2005 | Matt Kehoe
We are experiencing a situation that we would really appreciate some expert opinions on. Our process prints solder paste then reflows it without components. Normally the paste wicks into a very shiny rounded meniscus. Even over gold, the round pads a
Electronics Forum | Fri Feb 28 08:48:00 EST 2020 | SMTA-Joe
We've made the decision to move towards Gold Immersion on our PCBs to eliminate flatness issues with QFNs and BGAs. Land/component pad geometry, population density, and other factors, have made it necessary to ensure a near perfectly flat surface tha
