Electronics Forum | Wed Nov 18 14:42:22 EST 1998 | Dave F
| I heard somewhere that SMEMA has joined IPC, and that the association has decided to boycott Nepcon from | year 2000. Can anyone tell me if this is true | Nick: SMEMA and IPC are talking about merging (EP&P, 11/98, p 18). Below is a news release
Electronics Forum | Tue Jan 11 09:47:01 EST 2000 | Dave F
Abbas: Sources of information on DFM/DFT are: � "SMTnet Express" articles on DFM by Earl Moon � IPC-D-279, 'Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies' � Books in SMTnet and SMTA book stores � Other examples ar
Electronics Forum | Sun Jan 17 19:21:06 EST 1999 | Wayne Bracy
To ALL: Guess I have indicated that I am not supportive of Trade Shows in general. Make it very clear that I do not support Nepcon West, East, Southwest, Philly, Japan, or UK. Of all of them I feel that there should only be Nepcon West. As for
Electronics Forum | Thu Dec 08 07:55:16 EST 2005 | davef
Your understanding of the situation is correct. In both cases, you solder to the nickel. The gold [Au] protects the nickel from oxidation. When soldering, the gold moves into solution in the solder and forms an intermetallic compound [IMC] with th
Electronics Forum | Sun Apr 25 04:12:34 EDT 1999 | Earl Moon
| At Sanders (Military manufacturer), we have only started using plastic parts within the past few years. After being tasked with reviewing the new J-Std-033, it became obvious to me our process for controlling device exposure is weak. We build very
Electronics Forum | Mon Mar 15 01:09:45 EST 1999 | P.L. Sorenson - Technical Consultant
>>Date: Fri, 12 Mar 1999 12:09:57 +1000 >>>From: Paul Hardaker >>>Subject: [h-all] WARNING: Win32/Ska.A (Happy99) Worm >>>Sender: owner-h-all@ob1.uws.edu.au >>> >>>A relatively new, and quite serious "virus" (really a Worm or >>>Trojan Horse) called
Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef
90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125
Electronics Forum | Thu Jun 07 16:33:15 EDT 2007 | mumtaz
Please, it does not matter the school from which it is you came, but what you learned from it that counts. It is simple mathematics my friends. Lets make things simple, shall we not? E=I/R..... this we all should know. We can use this to measure
Electronics Forum | Fri May 28 16:30:39 EDT 1999 | JohnW
| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect
Electronics Forum | Tue Apr 27 17:34:52 EDT 1999 | Jeff Sanchez
| | As I transfer prototypes/pilots out of my shop (because the designs are mature or Engineering confidence is high). How do I minimize my risk and ensure success for both the CEM and my boards. | | | | Best Regardsgroup. This would include low t
