Electronics Forum | Wed Mar 30 01:01:10 EST 2005 | vicknesh28
All, Has there been any finding from the component point of view in terms of non wets after reflow and if yes, can anyone share what was improved on the component to reduce the non wet defective levels. What would be the contribution from the compon
Electronics Forum | Wed Oct 26 14:29:55 EDT 2005 | barryg
We have a class 3 assembly we will be doing soon and I was wandering since the fillet heighth required for class 3 is 50% more than class 2, should I have my stencil thickness increased from 6 mil. to 7 mil.? This assembly is made up of 31 mil. pitch
Electronics Forum | Mon Mar 02 11:13:59 EST 2009 | jorge_quijano
Hi to everyone, I'm new with the Solder Paste Inspection machines, and I'm doing my first measures and I noticed that I'm getting a solder paste heigth of 7 & 8 mils using a 5.0 mils stencil, with metal squeegees and 0.0 Snap off. are this results no
Electronics Forum | Thu Mar 05 09:54:59 EST 2009 | davef
When you measure "solder paste heigth of 7 & 8 mils using a 5.0 mils stencil," are you measuring the top of a flat brick? Sometimes if you snap-off the stencil too fast, the paste touching the stencil walls form peaks along the edge of the brick that
Electronics Forum | Thu Aug 06 17:56:29 EDT 2009 | stevea
Don't forget about ASC International. Having the largest supported installed base of benchtop SPI systems in the world, I'm surprised we were missed. If you have any further questions, I woudl be happy to assist. We have performed hundreds of test
Electronics Forum | Fri Jan 24 08:14:24 EST 2014 | davem
m_imtiaz, Over the last 15 years or so I've found that using the stencil foil thickness +2mils/-0mils has worked very well. For example, if you have a 5mil stencil thickness your upper control limit would be 7mils and your lower control limit would
Electronics Forum | Sat Apr 25 19:40:01 EDT 1998 | Stan Traxler
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components We have appl
Electronics Forum | Tue Apr 28 14:50:43 EDT 1998 | Chrys
| | We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | | PCb substrate to compensate for thermal stressing in a | | Space enviroment. Has any one any ideas or contacts for | | dissolvable pads. this only applies to leadless components | Ro
Electronics Forum | Mon Feb 21 02:02:54 EST 2005 | JSS
First of all THANKS for thr reply. I totally agree with u that paste dried,stencil aperture clogged like probs comes during the production but we hv a visual inspection stage (with 5X illuminated lamp)after printing process and before inserting the
Electronics Forum | Tue Feb 22 01:38:42 EST 2005 | JSS
We r using QFPs of 0.5mm pitch and r not getting any soldering prob at the end.But some new customer insists upon the thickness check of the solder paste after printing. At present we don't hv thickness checking system.We r controlling the amount of
