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Heller 2043 Air – Mark5 Reflow Oven

Heller 2043 Air – Mark5 Reflow Oven

Used SMT Equipment | Soldering - Reflow

13 Heat Zones Voltage: 480V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, External Cool

Heller Industries Inc.

Heller 1808 Mark 3 Reflow Oven

Heller 1808 Mark 3 Reflow Oven

Used SMT Equipment | Soldering - Reflow

8 Heat Zones Voltage: 480V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, Fan Speed Control

Heller Industries Inc.

SMT Reflow Oven - 1826 Mark 5

SMT Reflow Oven - 1826 Mark 5

New Equipment | Reflow

The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!

Heller Industries Inc.

Heller opens Cleanroom in New Jersey Factory.

Industry News | 2013-09-10 17:48:54.0

We are happy to announce that we have opened a new Class 10K cleanroom in the NJ facility.

Heller Industries Inc.

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Technical Library | 2020-01-28 00:23:58.0

This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.

Heller Industries Inc.

Introducing Closed-loop Nitrogen Control To Solder Reflow

Technical Library | 2023-01-17 18:07:31.0

To achieve higher levels of consistency in PCB output, process engineers are able to maintain tighter controls and reduce process-related defects by using closed-loop process controls. At every stage of assembly, from screen printing through placement to reflow, closed-loop systems help control the variable factors that can have adverse effects on the process.

Heller Industries Inc.

Heller Industries Mark 5 Wins 2015 SMT China Vision Award

Industry News | 2015-05-18 10:27:49.0

Heller Industries has been awarded a 2015 SMT China Vision Award in the category of Reflow Soldering for its 1936 Mark 5 Reflow Oven. The award was presented during April 21, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China 2015.

Heller Industries Inc.

Soldering Company of the Year 2020 - Heller Industries

Industry News | 2020-11-03 18:16:39.0

2020 Global Surface Mount Technology Company Of The Year Award (Soldering Equipment)

Heller Industries Inc.

Heller 1936 Nitrogen – Mark 5 Reflow  Oven

Heller 1936 Nitrogen – Mark 5 Reflow Oven

Used SMT Equipment | Soldering - Reflow

10 Heat Zones Voltage: 380V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, Dual Lane (MFFM), Fan Speed Control, CBS, Reactor, Cool Pipe

Heller Industries Inc.


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