Electronics Forum | Thu Jan 06 16:11:07 EST 2005 | Chunks
It appears your board house is having a problem with the solder resist (mask). From the couple pix it appear that the holes are being plugged by the mask, so your HASL is not able to be blown out during the hot knife process. Time to call your boar
Electronics Forum | Fri Apr 06 11:37:19 EDT 2001 | raton
We had the same problem years ago when we started using a radial inserter. The inserter would dutyfully insert and clinch the leads. The problem in our case was the component body sealing to the fab, especially on electrolytics caps with a film jac
Electronics Forum | Thu Jul 08 15:38:27 EDT 1999 | Earl Moon
| Thank you all for your replies. Thanks to your replies and backup from the IPC-SM-782A (section 3.6.3.2) and James Blankenhorn's "SMT Design Rules & Standards," the designer has agreed to provide adequate clearance between the via and the pad. |
Electronics Forum | Thu Apr 05 13:54:18 EDT 2001 | CAL
Do the parts sit directly on the PCB? Typical 2.0 mm Max is desired for the component to be off the PCB. Are stand-offs an option? The long lead wiggles as it passes through the wave and thus agitating the air out.Does your wave a "dancer" option?
Electronics Forum | Fri Apr 27 10:38:30 EDT 2007 | pjc
No dome needed. You should check what type probe you have. You can look here and consult with them: http://www.qualmaxamerica.com/qualmax/leeno/semi.asp?string=ICT
Electronics Forum | Tue Mar 05 22:34:27 EST 2002 | YoYo
You better be careful how you plug vias at screenprint - we currently have a customer that wants vias plugged, so we had a 2% aperature reduction so we would not have to much paste, I believe it should have been reduced more because some of the solde
Electronics Forum | Fri Apr 27 10:55:54 EDT 2007 | Brett
Pete, is there a probe-style that will accomodate a via that's filled, but a little concave (inward) fillet? The ICT personnel complains about this scenario too. I'm not an ICT person, but I do know that there are pogo pins that have a crown (for t
Electronics Forum | Mon Mar 04 17:52:59 EST 2002 | davef
Yes, providing the surface of the via is solderable. * If so, how much paste? => Vias come in various sizes. Boards vary in thickness. So, the amount of paste to fill a via varies. Roughly, you�ll need twice as much paste as the volume of the via
Electronics Forum | Fri Mar 24 08:44:08 EST 2006 | Mark
I have used tooling holes, connector holes, via holes, and others. As long as the hole is consistent than it should not be a problem. I have never tried a pad for a fiducial before because of the paste being on it and thought it would not work. So ma
Electronics Forum | Fri May 14 13:18:00 EDT 2010 | cyber_wolf
Search "paste in hole" or "intrusive reflow"
