Electronics Forum | Mon Nov 16 14:01:31 EST 1998 | Earl Moon
| Has anyone heard of a process called White Tin for depositing a solderable surface on a pcb rather than the standard hot air solder leveling? | White tin is another take on the tin immersion process proported to eliminate problems associated with
Electronics Forum | Thu Jan 15 10:33:05 EST 2009 | rrpowers
One thing you must be very careful with when using Bismuth is that there is no lead anywhere else within the process, either components or boards. Lead-terminated components or hot air solder leveled (HASL) finished boards used in combination with a
Electronics Forum | Wed Feb 03 22:47:48 EST 1999 | Chris G.
| Hi! | | Does anyone know any roadmaps for board plating materials. Especially I'm interested in finishes, which are plated onto copper. | | Teemu M�kiniemi | Teemu, For some time now, as I am sure you are aware, the PCB industry has been tryi
Electronics Forum | Fri Sep 24 10:57:18 EDT 1999 | Earl Moon
| Hi Folks: | | We've been having bridging problems on our fine-pitch QFP's, despite thorough inspection of paste height, volume, and placement accuracies....profiles look good also. | | The bridging is happening after coming out of reflow...one la
Electronics Forum | Sun May 23 15:12:59 EDT 1999 | JohnW
| We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor
Electronics Forum | Fri Aug 21 07:57:20 EDT 1998 | Earl Moon
| | | Will somebody please explain HASL (here). Thanks. | | Tryin: HASL: Hot Air Solder Leveled. A board fabrication process that applies an oxidation preventing solder coating to copper pads on the board. Dave F | You do this to keep the green s
Electronics Forum | Sun Apr 25 11:18:45 EDT 1999 | Earl Moon
| Hello all, | | Been doing some comparisons on joints made using the soldering iron versus reflowed solder paste (on a QFP package). The difference is quite significant: the joints made by the soldering iron are inconsistent and in many cases not
Electronics Forum | Mon Sep 23 11:13:12 EDT 2019 | tsauve
I forgot to update this. Customer insisted on reflowing SIM card directly to PCB, as per their previous CEM. It worked. No deformation of the SIM card - assembly works - records data to SIM card. Note that using hot air reflow type (rework station)d
Electronics Forum | Thu Nov 04 10:29:10 EDT 2010 | 18424
Hello all, Has anyone used Kester 2331-ZX water soluble flux on selective soldering and expirienced a white film after soldering. I have seen this on and off for a few weeks now and believe it is a chemical reaction with the solder mask or improperly
Electronics Forum | Thu May 09 11:59:34 EDT 2002 | russ
One thing I have done in the past although it may not be feasable in your case, is to process through normal reflow and then saturate parts with a high solids water soluble flux and re-reflow with hot air, iron, or even another pass through the oven.
