Electronics Forum | Mon Apr 19 02:49:56 EDT 1999 | Raul N.
25 PPM)! 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate for the ga
Electronics Forum | Sat May 28 04:56:23 EDT 2005 | WDLau
Dear, I am looking for the supports, specification, etc of the solderiability of Hot bar Reflow process with: A). FPC plating with sb/pb= 90/10, to be mounted to B) B). Golden plating PCB Please kindly input, As far as I know the melting point of
Electronics Forum | Mon Jan 14 16:07:38 EST 2008 | larryo
Can you tell me what LED's you are wanting to use and what size panel you will be putting them on? What kind of parts per hour placement to you want. I have a very fast and accurate hot bar solder system that may meet your application. It maybe used
Electronics Forum | Tue Oct 04 20:18:17 EDT 2011 | denmark
Sir *We are using "HOT BAR SOLDERING" we are bonding "FFC" and "PCB" at 0.5mm pitch. Machine settings: Heating Temp. 310º, Colling Temp. 190º Delay Time 1sec We also using "BECKLITE" as Soldering Jig that can resist up to 400º. We are using 1 is to
Electronics Forum | Thu Jul 29 23:21:51 EDT 1999 | CH Lee
I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. This ceramic substrate
Electronics Forum | Mon Apr 19 08:50:46 EDT 1999 | J.H.
25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo
Electronics Forum | Mon Apr 19 14:38:01 EDT 1999 | Chrys Shea
25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo
Electronics Forum | Mon Apr 19 22:52:59 EDT 1999 | Dean
25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo
Electronics Forum | Tue Apr 20 23:18:48 EDT 1999 | KEVIN SIMPSON
25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo
Electronics Forum | Tue Dec 15 17:01:36 EST 1998 | Chrys
| Does anyone know what a TCP is? | What type of process is required for assembly, what type of equipment? | | Any help or resources on the subject would be greatly appreciated.. | | Thanks | Brain, TCP, or tape carrier package is the same as TAB
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