Electronics Forum: inspection devices (Page 5 of 21)

Re: BGA In-circuit Failure Analysis

Electronics Forum | Mon Jun 08 12:42:01 EDT 1998 | Earl Moon

| How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pr

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 20:55:33 EDT 2002 | scottefiske

I'm with you dave...please provide specifics as to defect condition... Are you getting good wetting to both land and lead? Is there any repeatability to lead/location/device? Do you have paste inspection capabilites to verify deposition? Is it a Pala

QFP w/ oxidized leads

Electronics Forum | Thu Mar 28 11:06:49 EST 2002 | Tony Fox

Our company carries out this service for major OEM and CEM's Our web site address is http://www.retronix.co.uk Every device after it has been re-tinned gose throught a vision inspection system were it is inspected for coplinarity etc, we also re-ball

Hand held microscope/camera

Electronics Forum | Mon Sep 29 14:24:20 EDT 2008 | Sundaram

Does any one know of handheld devices which we could use to inspect instead of looking through the microscope. We tried the ProScope and it didnt worked for us. Thanks, Sundaram

Voiding in LGA (LT) soldering

Electronics Forum | Wed Sep 01 07:44:36 EDT 2010 | sachu_70

Dear SMT-manufacturer, I would recommend to also have other device joints on board X-ray inspected to understand if void formations are seen across the board or confined only to one component. If seen across, your "Reflow Profile" could be the cause

Some ideas on Cracking in High Voltage Chip Caps

Electronics Forum | Tue May 26 18:17:22 EDT 1998 | Jerry

Our experience has been that mechanical crack occur vertically through the chip. In other words perpendicular to the board surface. You can sometimes tell through close inspection that the crack may have propogated from a point that the nozzle may

Pick and place machine for small productions. Any suggestions?

Electronics Forum | Thu Sep 19 12:29:57 EDT 2013 | deanm

What is your plan/budget for your reflow oven and paste printer? Those are equally important as a placement machine. Have you factored in other costs of in-house assembly such as inspection, moisture sensitive device storage, rework tools, cleaning p

MPM Momentum 2d Inspection questions

Electronics Forum | Wed Mar 07 13:58:06 EST 2018 | griinder

We are using Gerber EZ Teach to inspect near 100% of some boards. Many component footprints seem to be assigned custom packages. These custom packages come up as "preview errors" during inspection. I have noticed when I manually move the camera to th

Moisture sensitive Devices

Electronics Forum | Tue Feb 08 12:39:52 EST 2000 | Ashok Dhawan

I have three questions on moisture sensitive devices: 1. What is general practice on incoming / receiving inspection of moisture sensitive devices- which boils down to mostly FPDs and BGAs ? Traditionally, FPD packs were opened only at time of use

Inspection Equipment

Electronics Forum | Tue Sep 25 15:11:34 EDT 2001 | Rich Elensky

I have had good experience with the 6500. We used it to inspect both SMD and TH devices. (presence, polarity, correct part) I would suggest you contact CR (now Phton Dynamics) for the latest software. It has some serious improvments over early rel


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