Electronics Forum: ipc 610 class 2 (Page 5 of 28)

Upside Down Chips

Electronics Forum | Thu Mar 15 08:16:28 EST 2001 | davef

In a similar conversation ... Alex Krstic, NovAtel Inc. said ... Hello all. We recently received some boards with some of the chip resistors placed with their resistive elements towards the board. J-STD-001B and C view this as violation for both Cl

adhesive on pads

Electronics Forum | Fri Mar 29 17:58:21 EST 2002 | slthomas

We have a new assembly with bottom side components, and all the chip caps and resistors are 0603s. The dog boned shape of the caps necessitates a pretty big (and tall) dot to hold them still during placement, and when they get placed the dot squishe

Re: Solder Balls

Electronics Forum | Fri Aug 21 13:43:13 EDT 1998 | Ben Salisbury

| Hello everyone, | I am currently running a gold plated SMT board and am experiencing tiny solder balls between the pads and the masking between the 20 mil pitch devices. I'm looking at these boards with a 60x microscope. IPC-610 say's any visible s

What is 'toe down configuration' 8.2.5.6 IPC-A-610D?

Electronics Forum | Thu Apr 12 01:35:13 EDT 2007 | Haris

IPC-A-610D is a Acceptability of the Electronic assemblies so all your questions depends on the product classes either 1,2,or 3 and it is given in this standard about the acceptablity criteria of the soldering of any type of the components i.e. it h

Re: SMT component placement

Electronics Forum | Thu Feb 04 21:17:41 EST 1999 | Chris G.

| What allowances are people using out there for components off-pad, we currently use 50% of lead width without breaking trace/component clearances but we have a customer demanding 25% allowance ? | IPC states: 50% off pad for class 1 and 2 25% off

Component classification - What is Class 1,2,3?

Electronics Forum | Thu Jun 04 11:10:23 EDT 2009 | leemeyer

Are you refering to components or assemblies. Assemblies are classified as 1,2 or 3 per IPC-A-610. Components are classified 1 - 6 for moisture sensitivity per J-STD-020

Socket in wave soldering

Electronics Forum | Mon Mar 01 11:56:51 EST 2010 | pjc

Your IPC-610 workmanship manual will have the answer for you (I don't have the latest at my fingertips). Depends on what class you are building too, 1, 2 or 3 and the application of this connector on the product- which you must determine.

Soldering Specification Needed

Electronics Forum | Fri Sep 23 10:34:41 EDT 2011 | blnorman

IPC-A-610E "Acceptability of Electronic Assemblies" addresses this specific issue as well as most others. This issue would be to what class (1, 2, or 3) your assemblies would be governed by.

Wave Solder Question

Electronics Forum | Tue Jul 30 14:51:38 EDT 2013 | dyoungquist

How full is the barrel actually getting? Per IPC-A-610, 100% fill is the target but 75% fill is acceptable for Class 1, 2, and 3.

Golden Ground Pad Contamination with Solder

Electronics Forum | Fri Nov 17 11:03:32 EST 2017 | davef

IPC-A-610F, 10.1, Non-Soldered Contact Areas: Has words to the effect that for Class 1, 2, 3; it is defect to have solder or any other contamination in the critical contact area.


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