Electronics Forum | Wed Sep 06 05:55:15 EDT 2000 | randy
Our R&D uses Land Pattern Design based on Manufacturer's recommendation and not IPC Standard Land Pattern design. I suggested to shift to IPC but he just ignored me and laughed about it. We are encountering hips of wrong land pattern design since we
Electronics Forum | Thu Aug 16 19:59:42 EDT 2007 | davef
Hi Russ Here you go: * IPC-7351 - http://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=77b562c1-b8f8-db11-8a6a-005056875b22 * IPC-SM-782 - Surface Mount Design and Land Pattern Standard [Superseded by IPC-7351] * CM-770 - http://portal.i
Electronics Forum | Mon Jan 03 14:00:06 EST 2000 | John Anderson
Has anyone had luck with 0201 cap board design, solder printing and reflow? IPC-SM-782 does not provide much help. I am particularly interested in attach pad design, stencil aperture design and thickness, solder paste (mesh, metal content, etc.), and
Electronics Forum | Thu Nov 11 10:51:16 EST 1999 | KenF
Could anyone tell me where I can find some literature/standards describing the dimensions and solder land sizes of all common SMD components available in the market? IPC-SM-782 does provides some but not all. Thanks in advance for any response. Rega
Electronics Forum | Wed Oct 20 09:27:31 EDT 1999 | Bill Strachan
I suggest that you get a copy of IPC -SM-782A 'Surface Mount Design and Land Pattern Standard'. This gives component dimensions and recommended land patterns for nearl all surface mount components. You could also benmefit from a copy of TopLine Dummy
Electronics Forum | Fri Apr 23 11:31:35 EDT 1999 | J.J. Thomas
A customer told me that pad geometry was to be different depending on soldering process. I think this is untrue. What is stated in the IPC - SM -782 standards is that parts should be placed to elimanate a trailing edge. This however should not e
Electronics Forum | Mon Mar 30 12:46:14 EST 1998 | Justin Medernach
| Can someyone tell me where i can find some informations, | about optimal design of footpad for pasta dispensing. John, Check out IPC-SM-782. This refers to surface mount pad design for surface mounted components. The spec is available for purcha
Electronics Forum | Wed Aug 08 04:00:46 EDT 2001 | jackt
Folks, I 'm in progress of generating the DFM checklist for New Product Introduction on PCA. I need some reference articles to prepare it apart from IPC-SM-782 (surface mont design and land pattern standard)that I'm using now. Any idea of extracti
Electronics Forum | Thu Apr 02 11:19:41 EST 1998 | Justin Medernach
| I am looking for footprint details on a SM crystal. | Package type - Golledge GSX49-4. | Solder method - refolw Mark, Check with the good folks at IPC for land design. The spec should be IPC-SM-782. Also, see http://www.ITM-SMT.com. It's Phil Za
Electronics Forum | Mon Dec 13 00:48:33 EST 1999 | armin
Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? What�s the term unsupported and supported holes refer to in IPC-2221 9.1.2 Annular Ring Requirements? I have a proto-type PCB (designed by our R&
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