Electronics Forum: ipc-tm-650 and width (Page 5 of 6)

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW

| | | | | | Hi, | | | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)

Re: Adhesive Dispenser Vs. Screen Printing Adhesives Pros and Cons

Electronics Forum | Thu Oct 12 11:08:20 EDT 2000 | Fraser

Dave, Why on earth would you want to use a stepped glue stencil?. If you print slightly off contact the hight of your glue deposition will be roughly half the width of your adhesive aperture width so if you want a 10mil high deposit use a 20 mil ape

Help finding a high capacity pick and place machine

Electronics Forum | Wed Mar 20 12:28:40 EDT 2024 | poly

The Fuzion HC will do that many parts depending on the tape width. 8mm is dual per lane, big ones can take up a lot of lanes. Our boards have that many parts and I use two machines (gx11 and a gc30). I think the Panasonic is probably a better option

Re: Land patterns for 0612 and 0508 capacitors

Electronics Forum | Tue Nov 30 21:23:55 EST 1999 | cklau

hello; When we are doing component land pattern design , one thing will always be in our mind; that is the basic criteria or common land pattern design guideline for reflow and flow solder assemblies. For basic fomula in calculating resistors are:

Stencil type and design for 0.65mm pitch QFP100

Electronics Forum | Wed May 10 01:00:09 EDT 2000 | gary

0.65mm pitch QFP. I believe that this is the borderline for Fine Pitch. Will I have a good paste release with Chem-etch matched with a rubber squeegee? I'm planning of a 15% reduction on the Width and no reduction on the length. Any feedback whether

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Thu Mar 25 20:09:35 EDT 2021 | grahamcooper22

What is the QFP pitch ? What aperture dimensions have you chosen ? Is the stencil laser cut then polished ? Your AFTER stencil size looks promising...your BEFORE stencil aperture size looks disastrous...would surely give bridges.. Your pcb pad siz

difference between Q type and K type feeders

Electronics Forum | Sat Oct 25 19:02:45 EDT 2003 | Gabriele

Main difference is the reel holder position and for sure the clamping pin location. Tape feeding system is different. Any way they cannot be compatible among them. Q type feeders must be used for MV Q-Type placer and K-type feeders must be used for M

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Thu Mar 25 23:23:00 EDT 2021 | llawrence

The QFP pitch is 0.5mm. Pad size is 1.475 x 0.3mm, and the new aperture size is 1.32 x 0.22mm. I'm not sure about whether or not it is lasered, but on the newly ordered stencil I selected the polishing option. Looks like the pad width is already 2/3

Siemens S-27 Error Code Descriptions and Segment Issues

Electronics Forum | Tue Sep 02 15:35:55 EDT 2008 | modernprecison

I have a Siemens S-27 and I'm having occasional issues with 0201 components in particular. I'm using the 12 segment head and 902 nozzles with them. I'm making sure the magnet is clean of debris and the feeder is sitting flat. Most of the time they

How to Differentiate Class 3 and Class 2 products in terms of process

Electronics Forum | Mon Jan 12 21:31:26 EST 2015 | warwolf

The closer your inspection the more defects you will find, the more rework you do the possible cost you will add and the potential increase of damage you could do to your products if rework is not up to a machine copyable standard. "Is there any in


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