Electronics Forum: ipc610 (Page 5 of 17)

Radial capacitor placement

Electronics Forum | Sat Jun 19 17:05:25 EDT 2010 | bob2000

Thanks for sharing your work experience. I found a reference material with IPC standard (IPC 610) that specifies an exact heigth that a capacitor needs to be placed, I will check this standard specifications in more depth.

MQFP soldering issues - how can I improve?

Electronics Forum | Fri Aug 19 07:40:24 EDT 2011 | scottp

What do the heel fillets look like and what level of IPC-610 (class 1,2, or 3) are you working to? Do the joints on all 4 sides look bad or just the one side? Do other parts on the board look OK?

Process Tin lead vs lead free components

Electronics Forum | Tue Sep 13 08:45:51 EDT 2011 | rgduval

Lead free solder does tend to resemble cold solder joints after processing. Generally, this is acceptable. The latest IPC 610 has pictures of acceptability of lead free solder joints, which you can use to compare to the joints that you are seeing o

Soldering Specification Needed

Electronics Forum | Fri Sep 23 12:42:40 EDT 2011 | scottp

A solder drip like that is completely unacceptable. That could easily short two QFP leads. Very poor quality. Your customer is right to be upset. You need to pony up the money for IPC-610, agree with your customer to which level you're working (1

Soldering Specification Needed

Electronics Forum | Fri Sep 23 15:10:45 EDT 2011 | action_101

The IPC-610 class II spec is very reasonable. If they expect class 3 then make them pay for it....IMO

Soldering Specification Needed

Electronics Forum | Tue Sep 27 14:54:20 EDT 2011 | scottp

That's correct - IPC-610 doesn't tell you whether rework is allowed or not. That's a customer issue.

Probe Mark during ICT

Electronics Forum | Mon Jun 04 09:32:23 EDT 2012 | pr

IPC-610 should tell you if the joint is suspect. I would tend to think they would not have any negative effect.

Chip Die Damage

Electronics Forum | Thu Dec 06 15:27:36 EST 2012 | bmario

The package is flip chip BGA (FCBGA592) I found some info on leadless devices damages in IPC610 but it is not exactly what I am looking for.

SMT solder Covering component surface

Electronics Forum | Mon Jul 01 11:41:39 EDT 2013 | pbarton

Do you have access to an x-ray system? If so you can determine if the solder wetting to the lead along it's length meets the criteria set out in IPC-610. Pete B.

QFN welding problem by reflux oven 10 zones

Electronics Forum | Tue Feb 11 11:42:06 EST 2020 | slthomas

Yep....I just looked at a copy of IPC-610-G and am not 100% sure but I think it's Note 5, Table 8-16, pg. 8-96.


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