Electronics Forum: j-std 033 (Page 5 of 17)

Requirements for a room with SMT equipment

Electronics Forum | Wed Sep 20 16:15:53 EDT 2017 | davef

Some requirements to consider are: * Humidity and temperature controlled according to J-STD-001 * Electro-static discharge (ESD) control program according to ANSI/ESD-S-20.20. * Soldering technicians are trained and certified according to J-STD-0

Baking planars after new BGA placed.

Electronics Forum | Mon Aug 14 20:37:03 EDT 2006 | davef

JEDEC defines packaging, matrix trays, tape and reel, and like whatnot. You need to be searching ANSI and IPC. Find these documents: * ANSI/J-STD-020, Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices *

BGA Baking in Reels?

Electronics Forum | Sat Feb 02 08:19:40 EST 2008 | davef

Operator: use http://www.jedec.org/DOWNLOAD/search/jstd033b.pdf BillG: Sometimes, the recommended bake times are numbingly long, because the authors of J-STD-033 assumed that: * Component took-on a large amount of moisture * You want your component

BGA & QFP post reflow inspection

Electronics Forum | Wed May 04 04:31:44 EDT 2005 | siverts

What is the MS-level and floor life of the critical components (should be written on the MSD-bag)? What is Your climate condition in the production area (%RH, temp.)? Are you doing this inspection on every board or is it enough to do it on the first

Baking components at 70 degree

Electronics Forum | Tue Jun 17 12:57:26 EDT 2008 | sleech

You are correct. For the 70 deg. C drying temperature to be effective, the relative humidity must be as near to zero as possible. A pulling a vacuum on the chamber is an inexprensive and reliable way to accomplish this. Contrary to some claims, our e

J-STD-033B.1

Electronics Forum | Thu Apr 01 03:44:31 EDT 2010 | nico67640

Good Morning Nicolas, > > Per J-STD-033B, 5.3.3.2 > states that a Dry cabintet maintained at not > greater than 5% RH may be considered MBB > storage. > > Hope this helps > > Chris Thanks Chris for your answer. I'm ok with you about the per

Re: Moisture Sensitive Devices

Electronics Forum | Fri May 05 11:10:07 EDT 2000 | John Thorup

Hello Aerin...welcome Actually you have already found a very important web site for your research. Go to the SMTnet archives and do a search. You will find a wealth of practical information. After that, go to the IPC or the JEDEC website and downlo

Material Ageing and Storage

Electronics Forum | Thu Feb 22 21:01:12 EST 2001 | davef

We don't do this, but if we had to and lacking better advice, for all components I�d dry pack according to J-STD-033, store in a low temperature and humidity controlled environment [maybe using some semicon fab inert storage cabinets], review the eff

Humidity control

Electronics Forum | Wed Nov 07 10:59:55 EST 2001 | paulburt

Hello all, I have been tasked with bringing my company up to spec with J-STD-033, yes lucky me! My question is this: While I was searching the Web for suitable suppliers of dry cabinets I came across a company advertising a humidity control system f

Baking time for PCBA rework

Electronics Forum | Thu Apr 25 09:27:03 EDT 2002 | fmonette

Michael, This concern is well covered in J-STD-033, section 8.6 Board Rework. "...If the component temperature exceeds 200C, the board may require a bakeout prior to rework..." In other words, you only need to worry about moisture related defects w


j-std 033 searches for Companies, Equipment, Machines, Suppliers & Information