Electronics Forum | Tue May 31 22:55:08 EDT 2005 | davef
We think it will make little difference to your customer. It really depends on your customer's end-use environment though. Tough to guess. In a short time, both of pots will be "SAC" though.
Electronics Forum | Wed Nov 02 12:08:40 EST 2005 | chunks
It could be lack of preheat or flux. You can verify the flux by hand applying. I'll bet it's lack of preheat though. That's usually the case with selective solder.
Electronics Forum | Mon Jul 30 10:17:26 EDT 2007 | davef
immersion ...easily changes color.. See that's the GREAT thing about immersion coatings. If they change color, they probably will not solder well. Try that with other coatings.
Electronics Forum | Thu Jan 29 20:57:06 EST 2009 | padawanlinuxero
HI!!! its a ERSA Reflow Oven HotFLOW 7 and I really appreciate some help thanks
Electronics Forum | Thu Jan 29 15:06:42 EST 2009 | padawanlinuxero
http://www.flickr.com/photos/94427924@N00/3236723528/ and 94427924@N00/3235878901/" target="_blank">http://www.flickr.com/photos/94427924@N00/3235878901/ do you guys think these is a finish problem ?
Electronics Forum | Thu Jan 29 16:48:49 EST 2009 | slthomas
Looks like a time/temperature problem to me. However, there are a lot of solder fines surrounding the pads in one photo that go beyond what I'd expect from inadequate TAL. Is it possible that the board was misprinted and not completely cleaned, or
Electronics Forum | Tue Nov 16 06:52:44 EST 2010 | cacace
1 um". Some PCB manufacturer is telling me that this specification is not feasible in production. I would know if this position is due to the equipment (or process control) they have, or if in effect is not possible to satisfy my requests.
Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef
There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,
Electronics Forum | Thu Jan 29 11:30:56 EST 2009 | rgduval
As others have said, you'll have some difficulties getting good reflow on pb-free out of a 3-zone oven. We did it with a 4-zone for awhile, but only had really good success on low thermal density boards. That said, you should definitely check your
Electronics Forum | Thu Nov 03 09:43:55 EST 2005 | lupo
Check flux penetration and type of flux. How much is solid contents. The solder filling is better under Nitrogen. Check the time (speed) of the nozzle whether is correct. Usually For SAC305 the temperature of bath is 320C/degrees, but only for sel
