Electronics Forum | Tue Dec 19 12:01:29 EST 2006 | patrickbruneel
Here�s a link to a previous thread that might be helpful http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=6947&#Top Look what KEN has to say on the subject Patrick
Electronics Forum | Tue Feb 19 05:00:07 EST 2008 | muarty
We have used both Datapaq and ECD Mole in the past. Either system will do the job for you, slight preference would be for the ECD system.
Electronics Forum | Wed Feb 20 08:07:46 EST 2008 | ck_the_flip
Here's a good thread on this topic: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=9859&#Message39714
Electronics Forum | Thu May 29 13:12:10 EDT 2008 | yam6rider
Just like to know what you guys thoughts regarding mixed alloys. Production run SAC305 and some components are SAC105. So, which profile should you follow. SAC105? or SAC305.
Electronics Forum | Wed Jul 02 08:30:32 EDT 2008 | interflux_electronics
Why not follow SAC305? you would do so for any other component finish wouldn't you? A component finish of pure Sn would also not call for a pure Sn profile, would it?
Electronics Forum | Thu Nov 01 10:57:34 EDT 2012 | kris1128
Has anyone heard whether the elevation of a plant can effect solder joint formation? One plant at sea level, one at 7,000 feet elevation... same equipment and profiles, big voiding defects at higher elevation. I did a search and found no similar post
Electronics Forum | Thu Mar 13 01:42:58 EDT 2008 | Sean
Thanks Real Chunks and Davef...Yours input is valuable to me. My inputs towards your question asked below: Questions are: * Why did you tell us the following? "This BGA is installed with heatsink (with hook at both side of the heat sink) manually b
Electronics Forum | Tue Dec 13 17:41:04 EST 2011 | davef
A Study Of 0201’s And Tombstoning In Lead-Free Systems, Phase II Comparison Of Final Finishes And Solder Paste Formulations http://sheaengineering.com/Documents/APEX%2008%200201s%20and%20Tombstoning%20phase%202%20paper.pdf CONCLUSION The condition
Electronics Forum | Mon Sep 23 18:11:10 EDT 2002 | steveb
On an assembly reflowed in air saw the same thing: 0201's with a grainular solder joint, but 0402's and above with perfectly formed joints. Reflow profile all within acceptable tolerances. Reflowing in nitrogen solves this problem, but increases t
Electronics Forum | Tue Oct 22 17:23:35 EDT 2002 | Yannick
Hi, I wondering if someone know the anwser to that. I'm using a solder paste 63/37 and on the solder joint we have a tiny little layer or flux who is like crystalin. I try to play with my profile the get it off but I don't get much success. So D
