Industry News | 2020-04-14 19:07:23.0
ITW EAE introduced the next-generation MPM® Momentum® II Printer with the release of the HiE and Elite models in November of 2019. Now the company is releasing the Momentum II BTB and Momentum II 100. The Momentum II BTB is a Back-to -Back configurable stencil printer that allows dual-lane processing for higher throughput without increasing either line length or capital investment.
Industry News | 2016-08-03 20:48:00.0
The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road,Laurel, MD 20723, on Tuesday, August 30th.
Industry News | 2012-12-14 06:50:53.0
e IPC APEX EXPO® Technical Conference will cover two dozen technical topics in the areas of board fabrication, design and electronics assembly.
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2014-05-27 11:24:56.0
The SMTA Capital Chapter is pleased to announce its third meeting of 2014 is scheduled for Tuesday, June 17, 2014, at Orbital Sciences Corporation in Dulles, VA.
Industry News | 2014-06-08 14:54:39.0
The SMTA Capital Chapter is pleased to announce its third meeting of 2014 is scheduled for Tuesday, June 17, 2014, at Orbital Sciences Corporation, Building 1 Auditorium, in Dulles, VA.
Industry News | 2014-09-06 17:51:35.0
IPC — Association Connecting Electronics Industries® has released the F revisions of two of the industry’s most widely used standards, IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies.
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Industry News | 2003-05-21 08:13:48.0
Two half-day workshops on Thursday during SMTA
Industry News | 2024-02-26 13:53:23.0
The SMTA Capital Chapter is excited to announce the upcoming SMTA Capital Chapter Expo and Tech Forum, scheduled for March 7th, 2024, at Sweeny Barn in Manassas, Virginia. This event promises a dynamic platform for industry professionals and enthusiasts to explore the latest advancements and trends in electronics manufacturing.
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