Electronics Forum | Thu Feb 17 12:04:52 EST 2005 | Indy
Have you tried doing solder dip test on these components? Or a Leaching Test, to see if the solder catches on the termination ? I suggest you should try these tests.. Cheers Indy
Electronics Forum | Wed Nov 02 03:35:09 EST 2005 | Slaine
I thought it was the tin content that leached the copper so presumed 100Sn would be more aggressive?
Electronics Forum | Thu Dec 22 10:37:05 EST 2005 | mark
Pete is correct. Lead from the "Leaded" parts will leach into the solder pot and eventually the Pot will become contaminated with unacceptable levels of lead. At that point the entire pot will have to be emptied and cleaned. NOT a fun thing to do!!
Electronics Forum | Mon Feb 05 17:39:53 EST 2007 | flipit
Remember, deionized water is very corosive. If the water is too deionized, 10 mega ohm, it will leach the ions from exposed metals. I had a stencil cleaner where the welds completely dissolved. The stainless steel tank was fine but the welds were
Electronics Forum | Fri Nov 09 13:41:06 EST 2007 | stepheniii
Don't forget that leadfree solder can leach the iron out of old solder tanks. Make sure yours is compatable with leadfree solder. You don't want the tank disolving, unleashing a tidal wave of molten solder.
Electronics Forum | Thu Sep 11 02:54:27 EDT 2008 | cobar
The 2 % is Ag.It is added to prevent leaching silver from the end caps of components.This alloy like 63/37 is eutectic and has a reflow temp of 179�C whereas 63/37 is 183�C.
Electronics Forum | Mon Oct 22 11:58:05 EDT 2012 | pbarton
I agree with Lou. Crepe paper is the way to go, MUCH cheaper and conforms much better to parts and surfaces being masked. Source items that have a rubber based adhesive and you will also avoid the conformal coating solvents leaching the masking adhes
Electronics Forum | Thu Nov 16 09:38:09 EST 2017 | vchauhan
I am curious to know anyone has used Samtec SEMA Solder Charge connector (SEARAY Seriese. I have done manufacturer's recommended solder paste and good reflow profile still the solder is leaching to the lead instead of becoming a solder connection. T
Electronics Forum | Thu May 04 10:35:24 EDT 2000 | Sal
THE TERMINONOLY I USED SEEMS TO BE INCORRECT , I THINK THE TERM I WAS LOOKING FOR IS WICKING . BACK TO THE PROBLEM , ISSUES WITH RESNETS, WHERE THE SOLDER PASTE SEEMS TO BE WICKING AWAY FROM THE TERMINATIONS OF THE COMPONENT TOWARDS THE VIAS WHICH AR
Electronics Forum | Mon Apr 28 16:36:11 EDT 2003 | razor
Component: Termination (barrier) NI, 120/3.0 um Solder Plate (outer) 90% Sn, 10% Pb, 120/3.0 um Solder: Multicore CR39, 95.5%Sn/3.8%Ag/.7%Cu @ 6mil Flex PCB: Cu, Ni, Au .2m to .5m Thanks
