Electronics Forum | Tue Aug 11 19:46:34 EDT 2009 | padawanlinuxero
Guys I have a question since the ever present problem with the crack switch we had to change to a low temp lead free solder paste in these case eutectic 58Bi/42Sn and 57Bi/42Sn/1Ag alloys, now the main question whats diferent between these one and th
Electronics Forum | Sun Sep 23 18:59:59 EDT 2007 | darby
I presume you are looking at low melting point solders. Firstly, I would consider running BOTH sides with the same paste - this will cut down the opportunities for a mix up with rework or retro-fit. Secondly, check that there is a cored wire availabl
Electronics Forum | Tue Sep 11 22:40:26 EDT 2007 | philip_yam
We are testing SAC paste for thru-hole components in the 2nd reflow process. The solder joint is alright but some problem encountered in FR1 or CAM2 PCB after multiple times of reflow due to the temperature. We are very interested in Zn or Bi-based l
Electronics Forum | Thu Aug 19 09:58:14 EDT 1999 | John Thorup
| | | we've received an inquiry if lead free solder for solder dips or surface mounting (cream solder) is available on a technical scale | Dr. Weber I'm not sure what you mean by "on a technical scale" but various no lead alloys are available in
Electronics Forum | Tue Feb 27 23:58:49 EST 2007 | KEN
Hmmm.... I had Intel survey my process on a mixed alloy line for 2 days. They periodically removed boards from all stations on the line (including post reflow). Boards were "crushed" and spearated into constituent plastic, ceramic and metals. All
Electronics Forum | Wed Dec 22 07:20:21 EST 2010 | piter
HI I used both of solder leveling HASL and ENIG, HASL I can recommended for biger pitch is cheaper solder leveling than ENIG but problem with that solder leveling is during the reflow process HASL isn't flat and during reflow process component move
Electronics Forum | Wed Sep 19 10:27:03 EDT 2012 | davef
My email mail machine couldn't send this to you ... Hi Stivais ... I didn't read the report. It seems to require downloading of a 'reader' of some sort. No thanks. If you would, just attach the report to this email. Regardless, energy-dispersive X-r
Electronics Forum | Wed Jun 22 14:14:42 EDT 2005 | Steve
Tin/Lead we have had no problem in masking off areas on a pcb during wave soldering. Lead Free alloys, Nickel Silver Copper would there be any compatability issues with a Peelable latex solder mask containing Ammonia. Really hot need to know.
Electronics Forum | Tue Oct 31 19:41:38 EST 2006 | Dhanish
Can someone advise if there is any risk if we use lead-free alloy wire during rework for Leaded Process?The reason for this proposal is to only have one type of solder wire being used in the line.This will eliminate any possibility of leaded wire bei
Electronics Forum | Tue Jun 15 17:36:32 EDT 2004 | johnthor
I don't recall if a specific alloy was mentioned just that most lead free alloys would not melt with a Pb profile and result in a less reliable joint in the long term. There was also concern about tin whiskers. Try the archives at http://www.ipc.or
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