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ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Videos

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service

ACI Technologies, Inc.

Yamaha Second Hand Cyberoptics Laser Sensor 6604098 For Yamaha YV88L SMT Machine

Yamaha Second Hand Cyberoptics Laser Sensor 6604098 For Yamaha YV88L SMT Machine

Parts & Supplies | Sensors

Detailed Product Description Brand: Cyberoptics Model: 6604098 Part Name: Laser Used For: YV88 Leadtime: Within 1~2days Condition: Original Used Second Hand Cyberoptics Laser Sensor 6604098 For Yamaha YV88L SMT Machine Specifications Product

KingFei SMT Tech

Practical Set-Up, Qualification of Cleaning Process in PCB Assembly

Events Calendar | Mon Jun 08 00:00:00 EDT 2020 - Mon Jun 08 00:00:00 EDT 2020 | ,

Practical Set-Up, Qualification of Cleaning Process in PCB Assembly

Surface Mount Technology Association (SMTA)

Juki Original new smt spare parts MR-J3-200BN-KM024 JUKI 40044539 2070 2080 3010 3020 SERVO AMP 2000W

Juki Original new smt spare parts MR-J3-200BN-KM024 JUKI 40044539 2070 2080 3010 3020 SERVO AMP 2000W

Parts & Supplies | SMT Equipment

Original new smt spare parts MR-J3-200BN-KM024 JUKI 40044539 2070 2080 3010 3020 SERVO AMP 2000W Specifications: Brand Name JUKI Y DRIVER Part number 40044539 Model MR-J3-200BN-KM024 Ensure Test in machine confirmation Guarantee 3 months

KingFei SMT Tech

How Much Strain Can a Package Take?

Industry News | 2011-12-14 15:35:33.0

Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.

Association Connecting Electronics Industries (IPC)

International Wafer-Level Packaging Conference Moving Toward Largest Program in Its History

Industry News | 2008-08-14 14:03:27.0

San Jose, CA � This year's fifth annual International Wafer-Level Packaging Conference (IWLPC), October 13-16, will be the largest ever, according to Dr. Ken Gilleo, IWLPC general chair.

Surface Mount Technology Association (SMTA)

Mydata MY100 DXe

Mydata MY100 DXe

Used SMT Equipment | Pick and Place/Feeders

FOR SALE: Mydata My100 DXe-14 Description:  Placement machine Manufactured: March 2012 Software level: TPSys 2.9x Details:     (2) HYDRA Speedmount @ Z8     (2) Midas Hi precision 2 mount     (2) Mydata Linescan Vision System     (2) M

Lewis & Clark

Cleanliness and Contamination Testing Services

Cleanliness and Contamination Testing Services

New Equipment | Test Services

Cleanliness and contamination refers to the analysis of residues and particulate that are present in electronics assemblies and components that could be harmful to the function and reliability of the system. Using our ROSE (Bulk Ionograph) we can ch

ACI Technologies, Inc.

Power Packaging Services

New Equipment | Design Services

The manufacturing factory at ACI includes a clean room, power electronics assembly and packaging laboratory. This specialized facility aids in the development of manufacturing and assembly technologies that can exploit the advantages of advanced mat

ACI Technologies, Inc.

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

Industry News | 2017-07-19 15:29:48.0

The SMTA and Chip Scale Review are pleased to announce the program for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.

Surface Mount Technology Association (SMTA)


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