Electronics Forum | Wed Jan 08 10:04:29 EST 2020 | emeto
We don't have plated vias on these pads.
Electronics Forum | Fri Jan 10 14:37:02 EST 2020 | emeto
Zack, would you recommend longer TAL or higher peak temp or both together?
Electronics Forum | Tue Jan 14 13:28:44 EST 2020 | cyber_wolf
Your profile looks textbook.
Electronics Forum | Fri Jan 17 02:49:11 EST 2020 | jakapratama
Yeah, that's a nearly uniformed ramp up profile, I can't see anything's wrong with that.
Electronics Forum | Thu May 09 18:06:42 EDT 2002 | bcceng
janchan, don't know how many LGA's/LCC/BCC's you are placing but a short term solution that I can recommend is the application of solder bumps to the component and than place it after board has gone through reflow or even at the same time. Our compa
Electronics Forum | Thu Feb 12 21:06:20 EST 2004 | davef
"LGA" [land grid array] is a pretty broad topic. Search the fine SMTnet Archives for background on: * BGA * uBGA * Flip chip * etc Consider: * Area Array Packaging Handbook: Manufacturing and Assembly; Ken Gilleo; McGraw-Hill Professional; 1st edit
Electronics Forum | Tue Mar 04 11:28:46 EST 2008 | clampron
Good Morning, I have an application that we are tooling up for that has several LGA (Land Grid Array) components. The Gerber files from the customer has a solder paste definition of 1:1 to the pad. As I look at this part, I cannot believe that this
Electronics Forum | Mon Aug 25 16:48:14 EDT 2008 | petep
Any tips out there for effective LGA rework? How is solder best re-applied? Can these parts be sent out like BGA's for "re-balling"? Like all of you, we build, profile place and solder for reliability, but the time will come when one of these co
Electronics Forum | Thu Sep 11 11:47:15 EDT 2008 | jeffcali
Depending on the assembly, I have applied balls on LGA's and reflowed them on using the rework hot air machine. Some places don't have the money to spend on mini micro stencils of all types, and thus spend the money on various sizes of solder balls
Electronics Forum | Fri Sep 03 10:52:39 EDT 2010 | arjan
Mark, Can you send some X-ray foto's of your LGA solderjoints, I am curious about the results of a marginal paste volume in combination with the Multicore LF318. Did you follow the recommandation of LT and use also soldermask defined pads on your bo