Electronics Forum | Thu Oct 27 20:37:49 EDT 2011 | tech1
the calibration error sounds like it is an electrical verifier issue. Are you testing parts before you place them? It could be that your centering electrodes are worn or dirty, or it could be the ribbon cables from the centering unit. If you are usin
Electronics Forum | Thu Aug 08 19:20:08 EDT 2013 | hegemon
I too am hoping a NADCAP guy might jump in here. I would like to know how this portion of the question is handled. Evidence of PM, periodic cleaning of EQ and tools, no issues. Thermocouple calibration? You would think that evidence of Oven CAL
Electronics Forum | Fri Jul 23 10:47:31 EDT 1999 | Mark D. Milward
There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not performing th
Electronics Forum | Thu Mar 03 11:49:23 EST 2005 | Rob
Doesn't that depend on your company's culture & management style? We (and I feel slightly dirty using this word)empowered our end of line inspection/touch up people & trained them to know what is good or bad - so issues can be immediately fed back,
Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq
Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the
Electronics Forum | Wed May 07 10:15:46 EDT 2008 | llaerum
We are also having some issues with certain small parts. In our case this is tantalum caps and 0402 caps. We had a vendor admit after much discussion that the plating used from a particular orgin was different on the tantalums. The tehory is thatthsi
Electronics Forum | Wed Jan 12 13:42:19 EST 2011 | dwonch
Hi All, I'm hoping there is a PCB expert or two hanging around. We're having some solderability issue on our boards. The finish is ENIG but it doesn't seem to be related to the finish process itself. We did SEM and EDX analysis and found aluminum an
Electronics Forum | Mon Nov 26 16:07:56 EST 2012 | jerlong
Greetings, Does anyone know where to find a tape and reel flatness specification? Looking at the EIA 481-B standard, there is no reference to the tape flatness (the images shown may "imply" flatness from one side of the tape to the other, However I
Electronics Forum | Thu Oct 01 13:33:01 EDT 2015 | marlyn
Hey there fellow people with SMT > issues... What's the proper procedure for > soldering through-hole headers on the back-side > of the PCB (pins poking out on same side as SMT > parts)? ( Yes - I did the SMT side first and am > now faced with L
Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef
Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug
