Electronics Forum | Wed Nov 05 13:45:21 EST 2003 | Marc V.
Money is not a problem, I am more concerned with ordering the appropriate amount from the start. It doesn't have to be exact but close so I can do all of the off-line set ups and etc; At the same time I don't want to order double the amount because t
Electronics Forum | Wed Dec 10 10:36:42 EST 2003 | russ
I would contact your PCB supplier, they usually have some type of software for panel optimization. Each shop potentially uses different size panels so it is a good idea to ask them what they are using and go from there. Keep in mind that there are
Electronics Forum | Wed Apr 06 21:37:35 EDT 2005 | KEN
Are you saying you have solder balls (as in solder paste balls) at the lead tips (or land tip)? This means your thermal profile is not hot enough. why the sudden cahnge? I will bet the lead frame material was copper and is now alloy 42. sounds like
Electronics Forum | Tue Aug 23 13:03:14 EDT 2005 | davef
What's the point of such a test? * If you are operating a board in an environment that keeps the board at a temperature that is close to causing delamination, why not design a board that can tolerate such an operating environment, rather than contin
Electronics Forum | Fri Dec 30 11:03:15 EST 2005 | Mike
I would think that Ekra has some market share though certainly not as much as the Ford and Chevy of the screen printer market. As far as research by F & S, I would not put much stock in that despite the fact that the company is reputable. Don't kno
Electronics Forum | Wed Jan 24 09:52:50 EST 2007 | electronhose
Sounds like you need a support pallet to accommodate the narrow side clearance. Several pallet houses made pallets that work in screen printing that have flush board edge clamps that hold the board in the pallet yet allow the stencil to come all the
Electronics Forum | Sun Nov 04 01:04:04 EST 2007 | omidjuve
we are manufacturing some rf boards that works on a high frequency margins now our boards doesn't pass in impedance test and we concluded that the problem might cause by the solder paste that we are using . our solder alloy is sn62/pb36/ag2 and we t
Electronics Forum | Tue Jul 29 08:29:21 EDT 2008 | davef
Beyond the materials cost, one approach to estimating the cost of assembling a board is: 1 Direct cost * Determine the processes required to assemble the board * Separate parts on BOM according to process * Multiply number of parts in each process by
Electronics Forum | Tue May 26 15:39:16 EDT 2009 | mikesewell
Amkor's MLF guidelines are very similar to Actels. 1 to 1 on the stencil to part pad on the I/O pads, 75% with a grid windowpane, 0.125 mm/5 mil stencil. For example, the Actel area ratio for a 0.3 mm sq. pad and 0.125 mm stencil is 0.6 which seems
Electronics Forum | Wed Feb 10 22:32:22 EST 2010 | davef
"Because of the rapid curing features of this product, large amounts of heat are generated when large masses of material are mixed at one time."[ITW Plexus MA310 TDS] Questions are: * Have you looked at the exotherm curve for this stuff? * Can the c