Electronics Forum | Sat Sep 26 14:07:09 EDT 2020 | davef
Print no paste on the tin-plated, [test???] pad. Experiment by putting Kapton tape over the stencil aperture for the tin platted pad. Re-assess your reflow profile, since the liquidus of the two plating materials will be different. Evaluate your pa
Electronics Forum | Mon Oct 09 09:56:11 EDT 2000 | John
I've run up against the same problem that I know many of us in the industry face; our management wants to obtain a "world class" level of production. This has come up before, and I've looked through several responses dealing with ppm (dpmo), failure
Electronics Forum | Thu Aug 24 05:09:21 EDT 2000 | Wolfgang Busko
Hi Sarry, it�s a mess sometimes with those things. We all look for component issues and sometimes forget the packing material and how it handles. Those paper carriers often caused problems when for some reasons they were exposed to moisture during
Electronics Forum | Tue Jun 14 11:29:44 EDT 2005 | davef
Check government agencies for recommendations. For instance: http://www.hse.gov.uk/pubns/indg248.pdf Flux flume: Follow the recommendations of your materials suppliers. For instance: http://www.frymetals.com/pdf_uploads/ organicacidcoredsolderwi
Electronics Forum | Tue Nov 30 02:46:21 EST 2010 | libandara
We want to handle the materials such as PCB & MSD components as per IPC 1601 & J-STD-033. As such, we need a baking oven to perform this and to monitor (temperature – we have to maintain up to 200’C & humidity – below 5%)the control environment & ma
Electronics Forum | Tue Jun 29 14:55:22 EDT 2010 | rgduval
For the capacitors that Yageo analyzed... Were they taken out at representative points in the process?? ie. were samples taken from pre-assembly, pre-ICT, post-conformal coat, post-final test? You note that the parts 'seem' to be ok up to ICT. And
Electronics Forum | Wed Apr 26 11:50:18 EDT 2000 | Wolfgang Busko
Hi Sal, the way you do it has IMO some advantages: - no sophisticated support for the topside print - no extra thermal stress for the the bottomside bonding material - less possibilities to lose bottomside components by handling One disadvantage mig
Electronics Forum | Thu Oct 18 01:38:28 EDT 2018 | robl
Hi Jeff, Good question, but entirely dependant on what you are trying to do with it, your budget, and your company's eco system. For example, do you need traceability, scheduling, materials purchasing and handling, accounts, Customer management sof
Electronics Forum | Thu May 23 11:23:47 EDT 2002 | yngwie
Hi guys... Has anybody hv an experience with using a common or standard profile to reflow high mix brd ( say, low, medium and high )?. The reason for asking is that, we are running high mix low volume, and materials that were consigned is exactly as
Electronics Forum | Mon Nov 13 14:58:56 EST 2017 | davef
Determine the origin of the solder * Sloppy paste printing technique * Lax stencil underside cleaning practices * Sloppy misprint cleaning practices * Poor part placement practices creating solder balls * Poor material control allowing solder p
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