Electronics Forum | Mon Apr 26 22:40:27 EDT 1999 | Dean
| | | | Hey Guys! | | | | | | | | Look what I get to try and do this week! I got handed a cardboard box on Friday afternoon with the parts and 20 of these little jewels! That's both sides of the board by the way... | | | | | | | | Whoever laid this
Electronics Forum | Mon Sep 20 17:26:22 EDT 1999 | Earl Moon
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Mon Sep 20 17:46:21 EDT 1999 | Dave F
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Tue Sep 21 12:10:23 EDT 1999 | Mario
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Tue Jan 03 03:01:35 EST 2006 | Frank
The 740 and 760 basically have the same specs as far as component ranges: 0402-50mm components. The 760 is a bit more accurate and the vision system is better. The 740 was designed when BGA weren't really around and so it can barely vision center b
Electronics Forum | Thu Jun 29 11:52:23 EDT 2000 | JAX
sree, There is no Definite. You have to make the call. If you think the previous info was on target, use the info provided to find out the appropriate percentage relation between ball diameter, pad diameter, and aperture size. If you already run BGA,
Electronics Forum | Fri Sep 22 08:37:07 EDT 2000 | Erick Russell
For any rework machine a good optics system is important. A look-up look down is used for BGA components. 30X magnification is required for flip chip, MicroBGA and fine pitch QFP placement. Digital cameras are not required, CCD have a good enoug
Electronics Forum | Wed Jul 28 22:06:17 EDT 1999 | Dave F
| Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly app
Electronics Forum | Tue Jul 27 11:32:01 EDT 1999 | M.L.
| | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | 12BGA per assembly | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | Pads .014inch | | Vias within footprint .020inch | | Vias to be filled by bottom side(solder side) only
Electronics Forum | Thu Jun 24 23:52:36 EDT 1999 | Dean
| | | Dear guys, | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We
