Electronics Forum: minimum (Page 5 of 77)

Solder Fillet

Electronics Forum | Tue Jul 01 22:20:26 EDT 2008 | davef

Fillet Height [F]. Wetting is evident on the vertical surface of the termination as the minimum fillet height.

Component Staking

Electronics Forum | Wed Oct 07 09:15:27 EDT 2015 | jmatsoc

What is the minimum component size which requires staking?

Intermetallic Compounds

Electronics Forum | Thu Sep 21 20:59:55 EDT 2017 | davef

There is no standard minimum / maximum IMC thickness. * There needs to be an IMC * Thinner IMCs are preferred over thicker IMCs

Intermetallic Compounds

Electronics Forum | Tue Oct 24 11:56:44 EDT 2017 | babymythird0421

As far as I know there is no standard thickness minimum or maximum thickness. It depends

Solder Joint Discolouration

Electronics Forum | Sat Jan 19 12:39:16 EST 2019 | bane016

Have you tried to reduce the temperature for the second side of pcb?Try to reduce it to the minimum below the regulations by datasheet...

Minimum tension to be maintained in SMT stencil - Any Standards

Electronics Forum | Tue Jan 21 09:11:51 EST 2020 | emeto

What does supplier say?

Minimum tension to be maintained in SMT stencil - Any Standards

Electronics Forum | Sun Feb 23 21:50:08 EST 2020 | sssamw

Read 35-55 @ 5 position, 4 corner and 1 center.

Re: BGA PAD REDUCTION

Electronics Forum | Sat Jul 31 13:35:14 EDT 1999 | Miguel Mariscal

| Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board. | If you know what component your'e going to u

Solder Wetting Problems, Need Referee's

Electronics Forum | Tue May 31 10:44:16 EDT 2005 | Scott B

We have found that when the HASL thickness is less than 5 microns the tin in the HASL reacts with the copper leaving a SnCu surface with poor solderability and microscopic grainy Pb islands. The IPC does not specify minimum HASL thickness but we now

Solder balls under LLP

Electronics Forum | Fri Aug 26 17:27:48 EDT 2005 | saragorcos

Hello there, Most probably, since the solder balls are entrapped, it is a process indicator, but refer to IPC 610-6.5.3.1 on Excess solder / solder balls / splashes - it really depends on what class you are manufacturing, and the minimum electrical c


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