Electronics Forum: new and aegis (Page 5 of 52)

SMT optimization and improvement

Electronics Forum | Thu Feb 15 04:28:19 EST 2007 | shrikant borkar

hi We are in to Starting New Line CM212A and CM212D at Present Our BM123 is giving 13000 cph, Rated CPH 30,000 This Thread will help me. Thanks Shrikantborkar@gmail.com

High-end SPI and AOI?

Electronics Forum | Tue Jan 12 15:54:09 EST 2010 | chupitoone

Hi, Orbotech actually sold it's division to ORPRO Vision. They development of the equipment is still progressing in both their Reflow inspection and SPI systems. Both have newer versions of software released and at the show in SanDiego they demonstr

Tape and Reel Assistance

Electronics Forum | Fri Sep 28 15:44:33 EDT 2012 | tzawaide

Hi all... I'm in the market for a tape and reel machine; which is whole new animal for me. Looking for recommendations for a good quality and reliable piece of equipment. Your input is greatly appreciated!

SMT Adhesive and Other

Electronics Forum | Thu Feb 07 14:58:08 EST 2008 | operator

We don't have one of those cool air compressed syringes to dispense adhesive. We have to do it by hand. My question is does anyone have any suggestions on syringe size, needle size etc... for successful deposition of SMT adhesive? I know you can go s

Manncorp Pick and Place

Electronics Forum | Sun Aug 03 09:44:10 EDT 2014 | isd_jwendell

I have 2 experiences with Manncorp machines and support, both were not good. Example: One manual was written in Japanese. I requested an English version, but was told it doesn't exist so too bad. I had to pay a local translator to get what Manncorp

COB and wire bond

Electronics Forum | Mon May 07 11:02:17 EDT 2001 | Singh

Hi all. I am looking into the implementation of the Chip on Board process with eutactic bonding and the then using either gold or aluminum wire to make wedge type wire bonding. Since I am totally new to this, can somebody guide me thru the process,

OSP and SIR

Electronics Forum | Wed Aug 21 19:22:44 EDT 2002 | stownsend

Splitting hairs is putting it mildly. I�m just trying to rule out all variables. It doesn�t appear that we have an SIR problem, but since the newest variable is OSP (blame the new guy for all the problems), I have to consider it. I�ve seen this befo

ROHS and WEEE directives

Electronics Forum | Wed Nov 10 10:22:10 EST 2004 | Mike Campbell

We are an OEM manufacturer, and are beginning to look at how we will be affected by the ROHS and WEEE directives. As of now we have many questions, and few answers. Does anyone know of a good comprehensive source where one could get information on:

SPC and Wave

Electronics Forum | Thu Jul 14 11:04:53 EDT 2005 | dougs

yes SPC can be used on a wave solder machine, you should use a c-chart to monitor the amount of defects per board or group of boards, this will let you know if your process is stable, as you improve your process you should re-calculate your UCL, hope

RoHS and stencils

Electronics Forum | Fri Mar 03 14:40:22 EST 2006 | amol_kane

i think a more important issue here would be the reduction ratio. as LF solders have a higher surface tension, they do not flow as well as their leaded counterparts. therefore the stencil design may have to be changed (hence a new stencil) if the red


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