Electronics Forum | Mon Mar 13 14:26:45 EST 2006 | Wave Master Larry
Well, im not sure what plane you guys are on, but I can back up my what im talking about. Ya see I wnet to Soltec traingin back in 1995 for our new wave. I got a diploma proofing that I know what i'm talking about. no one else in my company has on
Electronics Forum | Tue Jul 20 05:29:14 EDT 1999 | Wolfgang Busko
| | | | | | | | Hi, SMTASSY | | | | | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | | | First, we do not do real series produktion, only prototypi
Electronics Forum | Wed Feb 24 10:23:04 EST 2010 | xps
60° C). Moreover (by IPC standard)... "White residues resulting from no-clean or other processes are acceptable provided the residues from chemistries used have been qualified and documented as benign...". So, use an EDX or IC analysis in order to
Electronics Forum | Tue Feb 23 16:45:36 EST 2010 | dyoungquist
Davef is right on as usual. We are doing exactly what you do. Some smt with no clean paste then the plate through connectors on our selective solder machine using water soluble flux. We then clean with a ultrasonic water process. We do see the re
Electronics Forum | Tue Aug 30 15:05:23 EDT 2005 | Shean Dalton
Dear Ing, Have you analyzed why some RF device aren't operational after washing? An assumption is that failures are related to the ultrasonic energy applied. Other possibilities are for poor rinsing, poor drying, inadequate washing on those failed
Electronics Forum | Mon Jan 17 17:38:29 EST 2011 | bandjwet
All: I am reaching out to get some suggestions on the right flux to use as well as a recommended cleaning process for soldering a KOVAR RF shield using 80/20 Au/Sn solder to a ceramic hybrid. The recommended profile is 4-5 min at 280C and at least
Electronics Forum | Fri Apr 18 14:25:51 EDT 2014 | horchak
what is the technology? Is there fine pitch, double sided, number of layers, lead free? If the pcbs are not of the highest quality you may be set up for failure with no clean process. Couple things to look at is your paste flux content versus medal
Electronics Forum | Mon Mar 30 11:02:37 EDT 2020 | SMTA-Eric
As we navigate through the CORVID-19 pandemic, many essential manufacturing facilities are still on line and operating. Some at reduced or modified schedules in following the guidelines to help reduce the spread of this virus. My question is in rega
Electronics Forum | Wed Feb 24 11:28:09 EST 2010 | vleasher
I apologize for being so vague. It is a standard leaded process using ALPHA OM-5100 for the SMT. So would a reduction in wash temp result in less white residue?
Electronics Forum | Tue May 23 15:40:17 EDT 2000 | larry
We currently use both Humiseal and Conap with OA flux. The flux MUST me cleaned off the assembly before coating. I know that Humiseal has coatings that are compatiable with no cleans as long as your processes are defined properly before your coating
