Electronics Forum | Wed Jan 25 00:29:22 EST 2017 | cmarasigan
This is our practice already, common profile both sides and we perform it during NPI stage. As long as zone settings are the same and profile requirements are meet, we consider it as same profile and no need to re-profile from bottom side process to
Electronics Forum | Mon Feb 06 22:38:46 EST 2017 | david_chiu
No matter in selective soldering or wave soldering process, higher pot temperature and longer wetting time can increase IMC thickness and joint strength(reliability), but as Daivf said, you need to care if the DIP component and bare PCB was damaged b
Electronics Forum | Fri Feb 16 10:25:31 EST 2018 | ameenullakhan
Hi Rob, Thanks. We have very high mix low volume products. Even our stencil suppliers have problem to fix. So we are landing up getting one more stencil after checking the issue in NPI build. we are trying to add up all and have guideline. which i
Electronics Forum | Sat Jan 05 09:34:10 EST 2019 | unisoft
5 minutes to program your assembly machine with the Unisoft ProntoPLACE software — http://www.unisoft-cim.com/pcbplace.htm --- contact us now & we will show you using your data or ours Use either CAD, Gerber or XY and BOM Save time on NPI, faster
Electronics Forum | Thu Oct 08 11:41:19 EDT 2020 | essusa
Not a sales pitch, just an update, the Essemtec jet print solution is maturing fast based on a lot of customer testing. It is fully capable to replace printers for prototyping and NPI. Being adaptive to different paste suppliers and different compone
Electronics Forum | Wed Jun 08 03:09:44 EDT 2022 | pradeep14
Thank you. In our organization also we are following loading verification before starting the placement. But i want know before starting the placement during NPI/Proto Build, what are the system need to be followed to cross check with Pick & Place pr
Electronics Forum | Wed Aug 03 07:29:03 EDT 2022 | pradeep14
Hi, We are facing the issue with Component orientation(Wrong orientation), during Proto build/NPI time in SMT for 1st board placement. We are not doing 1st board with STICKY board, directly placing the components with Paste board only. Pls suggest, H
Electronics Forum | Tue Aug 01 07:32:51 EDT 2017 | jlawson
Another commercial tool is Valor MSS Process Preparation from Mentor-Siemens (Valor), can handle Gerber, PnP, ODB++, Native CAD ASCII Files, BOM and CAD Merge, SMT Pn Programming, AOI exports , DFT Engineering - ICT/Flying Probe programming, Stencil
Electronics Forum | Tue Jun 06 14:26:00 EDT 2023 | spoiltforchoice
> In Hungary there are many EKRAs. Bosch, Zollner > and many big/small company are using them. I also > saw the latest DEK but I think DEK is > over-complicated, fast and good printer - but if > you have any problem, it cost a lot.
Electronics Forum | Sun Jun 18 13:15:57 EDT 2000 | Kevin Simpson
HI, We have placed with both Fuji Qp's and Universal Gsm's. We are running a small coil now on a Gsm with a sucessful rate.The Qp done well also, but the product is not ran on a Qp line, so no true production rate has been determined.I don't feel
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