Electronics Forum | Fri Dec 08 19:09:44 EST 2006 | darby
I have just started production run using this component. After reflow I see that there is an undercut of solder between the pcb and the lead instead of a fillet. This means that some of the leads are sitting above the solder with no wetting to the co
Electronics Forum | Mon Aug 31 07:56:39 EDT 2009 | d0min0
Hello, since some days we are facing strange problem with SMT component reflow paste on one side of the component is reflowed correctly while the other side is 10%-70% non-reflowed (same component on 3 positions per module, alwyas the same land pad)
Electronics Forum | Tue Sep 01 19:31:36 EDT 1998 | Kallol Chakraborty
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Tue Sep 01 09:02:24 EDT 1998 | Justin Medernach
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Mon Dec 18 16:13:15 EST 2006 | darby
AJ, No overprint. We have components in very close proximity that precluded that. Also we have differing areas of thermal relief for the pads from a large backplane, from none at all to open blocks to individual pad relief. After a few more experimen
Electronics Forum | Tue Sep 01 10:16:10 EDT 1998 | Mike Cox
| | We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | | Our pad design is .020" diameter pads with .025" solder resist diameter. Th
Electronics Forum | Wed Sep 02 08:52:13 EDT 1998 | Justin Medernach
| | We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | | Our pad design is .020" diameter pads with .025" solder resist diameter. Th
Electronics Forum | Mon Nov 17 11:09:56 EST 2003 | Frank
Hi, I have a soldering problem with a header SMT straight single row of 8 pins. It's a samtec #TSM-108-03-T-SV-P (P&P). The first problem I have is an allignement one. I do not use alignement pin for now but I expect to use it. Concerning solder
Electronics Forum | Tue Aug 18 02:10:14 EDT 2009 | sergey2007
Hello, I have a customer who recentely installed a vapor phase soldering system. Everything goes pretty well, but from time to time the customer has the same problem with the soldering: one of the components on PCB (usually, it's a QFP package) is ro
Electronics Forum | Wed Aug 19 18:28:01 EDT 2009 | ratsalad
I'd like to ask a question. Have you determined where all those solder balls are coming from? I even see them on top of U40 and U15. This seems like a dumb question to me considering the size of the part (and having seen pictures of only one boa
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