Electronics Forum | Mon Oct 23 07:10:14 EDT 2017 | emeto
For packages, you use packages names.There is only one SOIC8. The other 8-lead devices are there and it is your job to learn their names. For components descision should be made based you your whole(part number)system.
Electronics Forum | Tue Aug 10 11:23:11 EDT 1999 | danielm
We currently have 32 LEDs per board and are looking to change the LED from a gull wing package to another package. (possibly a chip type package). I have heard that some cases and LEDs do not like reflow. This part is not cost effective to have to pu
Electronics Forum | Wed Nov 06 12:52:24 EST 2002 | Chris Lampron
Hello Everyone, I have been noticing a trend. Many tray packaged parts are now being supplied with velcro straps to secure the trays. Am I wrong in thinking that this is a major source of static electricity? All of these components are BGA, QFP, TSOP
Electronics Forum | Wed Jan 14 18:33:21 EST 2004 | ex maintain leader
qfp tray one corner on the holder is 45 degree cutted there is the pin 1 bga also one corner is different in the tray at tape packaging I'm not sure, I have seen diferent comissions belong supliers
Electronics Forum | Fri Feb 06 03:56:47 EST 2004 | JaMi Smith
BGAs and QFPs packaged in Trays are oriented with Pin 1 or corner A1 oriented towards the Pin 1 identifier on one corner of the Tray, which is usually identified by a chamfered corner. The Trays themselves are usually governed by JEDEC Registered Ou
Electronics Forum | Mon Jan 25 18:15:39 EST 1999 | Joe
Greetings, We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? What about those components which come on blister tape, should they get baked and re-packed
Electronics Forum | Fri Jan 08 10:58:31 EST 1999 | Dave F
| Can anyone direct me to any literature (preferably on-line) relating to current SMT packaging usage worldwide and any trends therein. Thanks... Scott | Scott: Check "SMT" Magazine November 1998, page 92. TTYL Dave F
Electronics Forum | Fri Jan 08 02:27:00 EST 1999 | Kwang-Seong Choi
HI! I am a package engineer in Korea. I have some reasons to desolder excessive solder at the lead of TSOP and TSOJ after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. Does anyone know the
Electronics Forum | Tue Jul 06 19:45:03 EDT 2004 | ANDREW
Based on the attchment it looks like both are low profile and cater for high IO point.What are the challenges in running this 2 type of component?Is there any additional process required other than normal SMT for these 2 packages,like underfill ?
Electronics Forum | Wed Jul 07 18:36:17 EDT 2004 | russ
We place both of these packages on a regular basis and experience no issues. Just run 'em like any other BGA. Russ
