Electronics Forum | Thu Nov 30 14:49:54 EST 2006 | M. Sanders
Dave, Thanks - I couldn't agree with you more. Unfortunately, our "bean counters" have a different frame of mind.
Electronics Forum | Fri Dec 01 10:18:10 EST 2006 | realchunks
You're right Hussman, I kinda missed the follow thru on that one! Sorry for any confusion on my part boys. Huss, you going to APEX this year? We missed ya last year. L.A. this year....boo!
Electronics Forum | Fri Sep 03 03:56:41 EDT 1999 | Wolfgang Busko
| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
Electronics Forum | Thu Nov 30 15:19:56 EST 2006 | CK the Flip
Mike, dude, I feel your pain. Hearing stories like this makes my blood boil! It's almost as ridiculous as a customer who told me to put more solder paste on a MELF component to overcome noise issues - he used more solder paste as antennas to overco
Electronics Forum | Fri Sep 03 14:37:45 EDT 1999 | JohnW
| | We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these siz
Electronics Forum | Mon Sep 06 19:59:59 EDT 1999 | armin
| | | We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these s
Electronics Forum | Thu Nov 30 16:10:05 EST 2006 | Hussman
Wow, why all the anger? This gap you guys are talking about is measured as "G" in IPC/EIA J-STD-001 (Chunks was there, but she failed to read the fine print). And almost all parts that measure G follow Note 3 which states "Properly wetted fillet s
Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F
| Hi there, | I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? | | Thank in advandce. | rgs, | chiakl Chiakl
Electronics Forum | Wed Dec 15 19:31:26 EST 2004 | Thomas Denison
We have a ceramic BGA that the component supplier has misaligned the spheres in the fixture so they slant .007" out of alignment from the substrate pads. When the devices are tested at the component manufacturer this alignment issue also causes the
Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin
| | | | | Hi, | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | |