Electronics Forum | Thu Apr 17 13:37:11 EDT 2014 | anvil1021
Hello All....we have several hundred PCBs that we need to run with a no-clean solder process and the surface finish is OSP. Our preliminary testing has found that the solder will not wet the entire pad even if the pad is over printed? We have contact
Electronics Forum | Wed Jun 12 20:04:03 EDT 2002 | scottxiao
Thank you very much!
Electronics Forum | Fri May 06 08:39:59 EDT 2016 | kahrpr
The first issue I see is that you have a high potential of the 402 tombstoning.
Electronics Forum | Thu Sep 02 21:02:55 EDT 1999 | Paul Wareham
We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes?
Electronics Forum | Thu Jun 20 04:49:34 EDT 2002 | scottxiao
according to the ressult of cross-section and removing the component, I find there is no black area in the left pad, and the IMC is also normal, so the black nickle is less impossible. the PCB material is not common FR4, just some thing like ceramic,
Electronics Forum | Thu Oct 30 15:36:18 EDT 2008 | grantp
Hi, Sounds like your engineer does not know what he's doing. We have developed and built hundreds of thousands of boards with normal square pads for 0402, and we just use a 5 thou stencil with 5% reduction and it works well. Decoupling? What is tha
Electronics Forum | Tue Feb 15 14:35:41 EST 2000 | Balas
hi I am designing a test vehicle with a range of components on it(pbga, cbga,fc, mbga, and qfps). My concern is that I would like to use a single stencil for solder deposition and not a stepped stencil. That would require me to have aperture design a
Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef
Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1
Electronics Forum | Fri Oct 31 07:52:23 EDT 2008 | davef
For a better understanding of decoupling capacitors, look here: * http://en.wikipedia.org/wiki/Decoupling_capacitor * http://www.hottconsultants.com/techtips/decoupling.html * http://pcdandf.com/cms/content/view/3410/95/
Electronics Forum | Fri Apr 18 18:06:47 EDT 2014 | davef
Methods that can reduce the wettability of OSP: * Previous heat cycles * Previous cleaning cycles * IPC-1601 "Printed Board Handling and Storage Guidelines" says do not bake prior to soldering * Using improper handling methods BR ... davef
