Electronics Forum: parylene and connectores (Page 5 of 8)

Pin in paste connectors and lead-free questions

Electronics Forum | Thu Aug 22 16:25:18 EDT 2019 | scotceltic

Yes, unfortunately a lot of datasheets these days do not contain the temperature resistance to determine if it can handle the PIP application. In the past I have always used a 250 C at a min of 5 sec for the material. Also, the part should have sta

soldering and bonding on gold PCB's

Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef

For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s

Fuji cp3 and ip2 placement speed

Electronics Forum | Mon Aug 12 18:26:05 EDT 2002 | pjc

If you are talking actual placement rate- from first fiducial read of board no. 1 to first fiducial read of board no. 2, here is the best I've ever seen based on the boards I've run: CP3- 141 seconds for 468 components per board (all rectangular chi

Lead Free and Leaded Process Mix

Electronics Forum | Fri Jul 08 09:40:28 EDT 2005 | Jason Fullerton

"The only real problem we're seeing is some suppliers trying to use bismuth. That's a big no-no in a SnPb process and we won't accept those parts." Yes and no. Since the SnPbBi tertiary alloy melts at 96 degC, any product rated for storage above tha

Need opinion about KE740 and KE760 !

Electronics Forum | Tue Jan 03 03:01:35 EST 2006 | Frank

The 740 and 760 basically have the same specs as far as component ranges: 0402-50mm components. The 760 is a bit more accurate and the vision system is better. The 740 was designed when BGA weren't really around and so it can barely vision center b

Mix Pb and Pb free alloy

Electronics Forum | Thu May 25 11:31:52 EDT 2006 | muse95

Patrick, I believe you are mistaken about this being a myth. Many component manufacturers changed more than plating to make their component withstand higher temps. Some changed mold compounds, others changed plastic types used. Many of these change

Wiring Schematic Softwares and error checking

Electronics Forum | Sat Jul 19 12:22:55 EDT 2008 | operator

Are there any softwares OR functions inside of the softwares that allow a designer that is creating a very large complicated wiring diagram with say....many terminal blocks and connectors etc... to run a point to point check on his drawing? Bascially

Puzzling CSM84VZ errors, #118 and #120

Electronics Forum | Sun Nov 06 19:20:23 EST 2011 | jeffr

Tom, Does this only happen on one job or all jobs ? If this happens again..you should clear the RAM memory, but changing the 10 year 3v lithium battery on the motherboard should also be considered at the same time. RAM CLEAR PROCEDURE: Power off, rem

OSP PCB Shelf life and part packs

Electronics Forum | Wed Sep 26 10:05:41 EDT 2012 | testbloke

Although we do not have any soldering issues with our OSP PCB's, I am trying to establish clear rules with regards pcb storage and shelf life. Our PCB's are supplied in metalised moisture barrier bags but without desicant, our current rules as follow

Lead/Lead Free In-Line Wash and UT cleaners

Electronics Forum | Mon Oct 03 22:16:58 EDT 2005 | Ken

If that's the case, let your customer go. I have run into this situation recently. Q. Why do you not run a dedicated line for lead free? A. You (the customer) give less than 12 weeks forcast and expect us to have a dedicated line for your product?


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